Category: electronics

Best cyanoacrylate adhesive for shallow potting, encapsulation and bridge bonding

In applications where the adhesive is at least partly exposed (not completely interfacial), Born2Bond LightLock is worth evaluating. It is a hybrid cyanoacrylate adhesive that reacts to UV light to cure, making it a solid choice for bondline squeeze-out, electronics encapsulation or shallow potting, and bridge bonding applications like wire tacking. LightLock doesn’t require activators […]

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Protect your electronics in seconds with UV light and rapid moisture cure encapsulants

Dymax UV cure electronics encapsulants with secondary moisture cure resolve the challenge of encapsulating chip and component geometries which have shadowed areas under component bodies or leads. The bulk of the material cures in seconds with light, while the balance cures with ambient moisture. Light-curable formulations are becoming increasingly popular due to their significant benefits […]

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Case study: improving sealing quality while maximising productivity in gas sensor manufacture  

When gas sensor manufacturer DD-Scientific wanted to improve the accuracy, repeatability, and productivity of an epoxy sealing process, they asked us. DD-Scientific now benefits from robot-mounted preeflow® eco-DUO precision metering, mixing and dispensing systems, which save the company 23 days of staff time per year, while maintaining the high-quality the company’s products demand. DD-Scientific’s sensors […]

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Case study: putting electronics into an archery arrow with novel CAs

Application In today’s technologically-advanced world, consumers want products that are better, smarter and more intuitive to their needs. For brand owners and manufacturers, this means continuing to push the boundaries on innovative, increasingly-smaller devices that can give consumers new product options unlike anything they’ve seen before. The miniaturisation of devices can pose assembly and bonding challenges, […]

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White Paper: UV light and moisture curable electronics encapsulants

Encapsulants are often required to protect electronic components against moisture, chemicals, and rapid and extreme temperature changes while providing mechanical support and electrical insulation. Light-curable encapsulating compounds can provide significant benefits over conventional technologies, including very fast curing, lower operating costs and increased productivity driven by lower labour requirements, space savings, lower energy demand, and […]

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Dymax SpeedMask temporary masking for electronics soldering, conformal coating

Dymax SpeedMask masking resins for electronics applications cure on demand, in seconds, with UV/visible light. Used for temporary masking in printed circuit board assembly, they are suitable for either soldering or conformal coating processes. Rapid cure speed allows for flexibility, efficiency and productivity in production as the pcb’s are immediately ready for further processing – reducing […]

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Epoxy adhesives & potting compounds for specialist applications

The new Polytec PT brochure offers information on specialist epoxy resin adhesives and potting compounds for electronics, electrical engineering, optical and medical industries. It details high strength optically transparent epoxies, including formulations with flexibility in the Shore A range. Medical device manufacturers will find products which are biocompatible and tested to USP Class VI. These materials […]

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Video: Opti-tec 4200 clear polyurethane resin for potting & encapsulating

Opti-tec 4200 is an optically clear potting compound suitable for encapsulating LEDs and other electronic components. Opti-tec 4200 is a clear polyurethane resin for applications including lighting, illumination or when the electronics needs to be visible. It features excellent non-yellowing colour stability owing to UV resistant base materials and stabilisers. In double syringe or twinpack sachets, the […]

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New guides to electrically conductive & thermally conductive adhesives

We have issued two new guides which offer an introduction to the Electrically Conductive Adhesives and Thermally Conductive Adhesives produced by Polytec PT. Each guide gives a descriptive overview of the technology involved and related product applications in industries such as microelectronics, electrical engineering, power engineering and general energy. New, next generation technologies are introduced. Conventional […]

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Advanced dual-cure pcb conformal coating

Dymax Dual-Cure 9482 is a UV light and moisture-cure conformal coating specially formulated to flow underneath components on printed circuit boards and cure in these shadowed areas by using ambient moisture, which can result in faster throughput for through hole assemblies. Dymax 9482 coating demonstrates excellent re-workability which is of particular importance to manufacturers of expensive pcb’s or manufacturers looking […]

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Innovative electrically conductive adhesive

Polytec EC 275 extends our portfolio of specialist high performance conductive epoxies and adhesives. Polytec EC 275 has innovative specialist fillers which deliver excellent electrical conductivity (1×10-3 – 7.5×10-4 ohm-cm) within a low cost, two component formulation for applications in electronics, micro-electronics, opto-electronics, hybrids and sensor technology. Electrically conductive adhesives are widely used in the electronics […]

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Flexible, room temperature cure, electrically conductive adhesive

Polytec PU 1000 is an electrically conductive, polyurethane adhesive which addresses applications in die attach, bonding of components in hybrid circuit applications and surface mount technology (SMT); areas where silver filled electrically conductive adhesives have been used for many decades. Usually such adhesives are epoxy-based, and are two-component or premixed and frozen single-component systems – […]

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