Panel Discussion tomorrow: potting, encapsulating and underfills

We are delighted to have the opportunity to join this Panel Discussion tomorrow. Potting, encapsulating and underfills are all essential procedures in the assembly process. With miniaturization makes accurate, void-free processing important to maintain adequate support, protection and reliability. The panel will discuss the do’s and don’ts of these processes, followed by a Q&A session. Why don’t you join us?