Category: encapsulation

Protect your electronics in seconds with UV light and rapid moisture cure encapsulants

Dymax UV cure electronics encapsulants with secondary moisture cure resolve the challenge of encapsulating chip and component geometries which have shadowed areas under component bodies or leads. The bulk of the material cures in seconds with light, while the balance cures with ambient moisture. Light-curable formulations are becoming increasingly popular due to their significant benefits […]

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White Paper: UV light and moisture curable electronics encapsulants

Encapsulants are often required to protect electronic components against moisture, chemicals, and rapid and extreme temperature changes while providing mechanical support and electrical insulation. Light-curable encapsulating compounds can provide significant benefits over conventional technologies, including very fast curing, lower operating costs and increased productivity driven by lower labour requirements, space savings, lower energy demand, and […]

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Case study: developing electronic textiles with UV curing

Recent advances in semiconductor and microelectromechanical systems (MEMS) have reduced both their size and cost. The Advanced Textiles Research Group at Nottingham Trent University is incorporating these components into the yarn-making stage to broaden the possibilities for electronic textiles into areas like temperature sensing, medical monitoring, motion sensing, energy harvesting and illumination. By incorporating the […]

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Video: Opti-tec 4200 clear polyurethane resin for potting & encapsulating

Opti-tec 4200 is an optically clear potting compound suitable for encapsulating LEDs and other electronic components. Opti-tec 4200 is a clear polyurethane resin for applications including lighting, illumination or when the electronics needs to be visible. It features excellent non-yellowing colour stability owing to UV resistant base materials and stabilisers. In double syringe or twinpack sachets, the […]

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