Encapsulants

Encapsulants

About Encapsulants

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Depending on the needs of your high performance application, our range of encapsulants are supplied in a variety of options such as low density, lightweight, flame retardant, flexible, optical transmission, thermally conductive.

Dymax 9200-W Series UV Adhesives for Consumer Wearable Electronics

The Dymax 9200-W series of consumer wearable device adhesives and encapsulants cure in seconds on exposure to UV light and/or visible light in seconds and are free of IBOA.

The Dymax 9200-W series of consumer wearable device adhesives and encapsulants cure in seconds on exposure to UV light and/or visible light in seconds and are free of IBOA.

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WACKER Silicone Encapsulants and Potting Compounds

Silicone Encapsulants are effective for the potting and encapsulation of electronic control units, sensors, printed circuit boards, semiconductor devices or microchips.

Silicone Encapsulants are effective for the potting and encapsulation of electronic control units, sensors, printed circuit boards, semiconductor devices or microchips.

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Opti-tec 5012 Low Viscosity, Clear Epoxy Adhesive / Encapsulant

Opti-tec 5012 is a two component, low viscosity epoxy with very high optical clarity. It is designed for potting, encapsulation and adhesion of components where high optical clarity, good wetting and low viscosity are important.

Opti-tec 5012 is a two component, low viscosity epoxy with very high optical clarity. It is designed for potting, encapsulation and adhesion of components where high optical clarity, good wetting and low viscosity are important.

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Optical Adhesives & Encapsulants from Polytec PT

Polytec PT offers a range of high performance optical adhesives for use in optical and medical applications. The materials are either optically clear or black opaque.

Polytec PT offers a range of high performance optical adhesives for use in optical and medical applications. The materials are either optically clear or black opaque.

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Light Cure Encapsulants for Electronic and PCB Assembly

Dymax 9000 Series Electronics Encapsulants are tough, flexible UV curing electronics-grade encapsulants which are single part and cure in seconds; they cut costs and processing times associated with electronic assembly. These encapsulating materials have high ionic purity, excellent adhesion and resistance to humidity and thermal stock to effectively protect components. Dual cure (light/moisture) available.

Dymax 9000 Series Electronics Encapsulants are tough, flexible UV curing electronics-grade encapsulants which are single part and cure in seconds; they cut costs and processing times associated with electronic assembly. These encapsulating materials have high ionic purity, excellent adhesion and resistance to humidity and thermal stock to effectively protect components. Dual cure (light/moisture) available.

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