Potting Compounds

Our range of potting compounds and encapsulants includes epoxy, polyurethane and silicone chemistries, to provide for every application.

Potting Compounds

Description

Depending on the needs of your high performance application, our range of potting compounds come in a variety of options such as low density, lightweight, flame retardant, flexible, optical transmission, thermally conductive.

WACKER Silicone Encapsulants and Potting Compounds

Silicone Encapsulants are effective for the potting and encapsulation of electronic control units, sensors, printed circuit boards, semiconductor devices or microchips.

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IRS 2012 Low Density Light Weight Epoxy Potting Compound

IRS 2012 is a very low density, light weight epoxy resin system with excellent physical properties. It is used in systems where weight is critical (e.g. auto sport, motor racing, aerospace).

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IRS 2013 Low Stress Flexible Epoxy Encapsulant / Potting Compound

IRS 2013 is a black, flexible epoxy encapsulant resin system. Its low viscosity and fast room temperature cure make it an ideal potting compound when low stress or adhesion to flexible substrates is required.

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IRS 2040 Epoxy Potting Compound, Flame Retardant Encapsulating Compound

IRS 2040 Epoxy Potting Compound is a non-toxic general purpose flame retardant encapsulating compound. It has a long pot life and can be cured at ambient temperatures or accelerated with heat. When cured, IRS 2040 exhibits good surface finish, high electrical strength, good thermal conductivity, low exotherm and low cure shrinkage.

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IRS 3071 Polyurethane Potting Compound, Flame Retardant Encapsulating Compound

IRS 3071 is a polyurethane potting compound. It is semi-rigid, room temperature curing and flame retardant, specifically designed for the cost effective encapsulation of a variety of low to medium voltage electrical and electronic applications.

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Opti-tec 4200 Optically Clear Polyurethane Encapsulant & Potting Compound

Opti-tec 4200 is a clear, water-white polyurethane resin designed for the potting or encapsulation of electronics, LEDs, electrical products and other items where high transparency and aesthetics are important.

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Opti-tec 4210 Optically Clear, Hard Polyurethane Encapsulant and Potting Compound

Opti-tec™ 4210 is a two-part, high hardness, room temperature curing polyurethane resin designed for the potting and encapsulation of electronic devices requiring very high clarity.

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Opti-tec 4220 Semi-opaque, Translucent Polyurethane Encapsulant for Electronics and LED Potting

Opti-tec™ 4220 is a two-part, flexible, room temperature curing polyurethane resin, designed for potting, encapsulation and protection of LED arrays and other lighting products.

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Opti-tec 5001 Optical Epoxy Adhesive

Opti-tec 5001 is a two component, very low viscosity epoxy with very high optical clarity. It is designed for potting, encapsulation and adhesion of components where high optical clarity, good wetting and low viscosity are important.

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Opti-tec 5020-1 Clear Epoxy Potting Compound

Opti-tec 5020-1 is a clear, two component, low viscosity clear epoxy which will cure in thick sections at room temperature. In thin section, it is clear and transparent. Opti-tec 5020-1-B is an opaque black version.

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Opti-tec 7020 Optically Clear Silicone Potting Compound

Opti-tec 7020 is a two part, clear, non-yellowing liquid silicone elastomer suitable for encapsulation of sensitive electronic or opto-electronic parts.

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Thermally Conductive Adhesives from Polytec PT

Polytec PT offers a range of high technology, thermally conductive adhesives. The products are two-part and single-part epoxy systems designed for all applications where heat transfer is essential, including heat-sinking and ceramic packaging.

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Dymax UV Light Curing Adhesives for Electronics Assembly

Dymax adhesives are ideal for bonding heat sinks and heat sensitive components, wire and component tacking, strain relief of large parts and securing hand inserted components prior to wave soldering.

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