We offer adhesives which exhibit thermal and/or electrical conductivity. Applications include thermal management, electronic circuits, shielding, and die-attach in micro-electronics, hybrid circuits, chip-on-board (COB), LEDs, component manufacture, displays, flexible circuitry, medical devices and optics/optoelectronics.
Electrically conductive adhesives can be either two-part or single-part epoxy systems, and are designed for electronic interconnects in a wide range of applications, including hybrid electronic assembly and solder replacement.
The adhesives are offered in process convenient packages, including twin-packs and pre-mixed and frozen in dispensing syringe barrels.
Thermally conductive adhesives can be used as a joining technique, bonding components to create a durable mechanical connection, while enabling heat to transfer from the warmer component to the colder component. In many cases, thermally conductive bonding is an alternative to conventional connection processes such as soldering, welding or screwing.
Thermal management of electronic components continues to grow as an application, as we squeeze more power into smaller devices.
See below for the full selection of our conductive adhesives.
WACKER Thermally Conductive Silicone Adhesives & Potting Compounds
Modern power semiconductor devices and electronic assemblies are both subject to the same trend – miniaturisation. This is leading to ever higher operating temperatures. WACKER’s thermally conductive silicone adhesives have a key dual role in this process. On the one hand, they transfer the device’s heat to the heat sink or other dissipation components. On […]
Electrically Conductive Adhesives from Polytec PT
Polytec PT electrically conductive adhesives are designed for electronic interconnects in a wide range of applications, including hybrid electronic assembly and solder replacement.
Thermally Conductive Adhesives from Polytec PT
Polytec PT offers a range of high technology, thermally conductive adhesives. The products are two-part and single-part epoxy systems designed for all applications where heat transfer is essential, including heat-sinking and ceramic packaging.