We are getting tough with electronic components that need to be made more rugged – to be more resistant to shock, vibration and rough handling. This “toughening-up” process involves edge bonding or underfill of components with the recently introduced Dymax 9422-SC or DYMAX 9-20790 room temperature, fast, light cure adhesives.
In particular the Dymax 9422-SC is a component reinforcement and staking material engineered to hold critical components, such as Ball Grid Arrays (BGA) and Video Graphic Arrays (VGA), for secondary processes or for long-term reliability. These light-curable adhesives dispense and cure in seconds to provide the optimal balance of production efficiency and technical performance. This will be of interest to anyone confronted with the need to ensure that critical components on printed circuit boards remain in place and with electrical integrity throughout the manufacturing, assembly qualification and service environment for the duration of a product lifecycle. Light curing adhesives dispense and cure in seconds to provide the optimal balance of production efficiency and technical performance with bead shape designed to wet both the board surface and the component edge without seeping into shadowed areas. This material is highly thixotropic for zero movement prior to cure – 9422-SC is halogen and silicone free and RoHS compliant.
The use of BGA edge bonding adhesives or underfills can eliminate leadless component interconnect cracking due to CTE mismatches. Typical applications include mobile phones, PDAs, laptop computers, gaming consoles, GPS computers and digital music players.
Dymax 9422-SC features See-Cure technology (going from blue when uncured to colourless when cured) and features fast dispense and cure, easy re-work, simple visual inspection and covering in seconds with improved bond strength for die and pry testing.
