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UV Light Curing Adhesives
for Electronics Assembly
Strain Relief, Component Tacking and Heat Dissipation
- Fast "instant" cures
- Single part formulations
- Cure on demand - only upon exposure to light
- Excellent adhesion
- Precise and easy dispensing
- Room temperature storage - unlimited pot life
- Minimum one year shelf life
Description
Achieve increased productivity over epoxies, silicones and hot melts with easy to use, low cost adhesives. DYMAX UV adhesives cure in seconds. The "on demand" cure feature of these resins means no rework as a result of adhesive migrating onto solder pads or through holes. DYMAX adhesives are ideal for bonding heat sinks and heat sensitive components, wire and component tacking, strain relief of large parts and securing hand inserted components prior to wave soldering. They can be easily removed for field repair and re-applied.
 Unitising, strain relief |
 Wire tacking |
 Heat dissipation |
 Ruggedising |
| Product Selector Guide | ||
|---|---|---|
| Product | Applications | Features |
| Electronics adhesives | ||
| DYM 9-20558 | Bonding Kapton™ polyimide to pcb; strain relief | Flexible; moisture barrier for metal, ceramic, epoxy and glass filled plastics |
| DYM 910 | Wire and parts tacking; strain relief; unitising | Flexible; good adhesion; mechanically removable |
| DYM 912-A | Wire tacking | Fast curing; withstands wave soldering whilst resisting most solvent and aqueous cleaning processes |
| DYM 914-A | Wire tacking on pcb's; for manual and fully automated dispensing systems | Good insulation qualities; shock absorbing; deep cure capability; bonds well to porous surfaces; rapid cure speed |
| DYM 921-Gel | Ruggedising heavy components | Rapid curing; high strength; hard, clear bonds |
| Thermal management adhesives | ||
| DYM 9-20689 | Adhesive paste; for parts subject to disassembly | Repairable with application of heat; cures with heat or activator |
| DYM 9-20691 | Mounting heat sinks | Medium strength; for extreme temperature ranges |
| DYM 9-20696 | Adhesive paste; cures with UV light or heat or activator | High thermal conductivity for dissipating heat in high power assemblies |
| DYM 9-20699 | For parts subject to disassembly | Self shimming; for maintaining specific gap size |
| DYM 991-Rev A | Mounting heat sinks and heat sensitive components | High strength for permanent assemblies; UV, activator or heat curing |
Other Information
Download the complete DYMAX Electronics Adhesives, Coatings & Encapsulants Selector Guide  (548Kb) |
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| Download the DYMAX Thermal Management Adhesives Applications Bulletin (298Kb) |
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Our Technical Bulletins & Articles page has links to:
- Technical Bulletin: Wire Tacking - The Options
- Article: Case Histories of Light Curing Adhesives in Electronics Manufacturing
- Article: Advances in Light Curing Adhesives and Coatings Lead to Process and Quality Benefits in Electronics Manufacturing
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See also! UV cured masking for electronics Silicone thermally conductive compounds Light curing conformal coatings UV curing lamps & systems
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Additional printed catalogue or brochure available |
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October 2007
Version 2.3
17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
Tel: +44 1865 842842 Fax: +44 1865 842172 info@intertronics.co.uk
© INTERTRONICS 1997, 2007