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DYMAX


UV Light Curing Adhesives
for Electronics Assembly
Strain Relief, Component Tacking and Heat Dissipation

  • Fast "instant" cures
  • Single part formulations
  • Cure on demand - only upon exposure to light
  • Excellent adhesion
  • Precise and easy dispensing
  • Room temperature storage - unlimited pot life

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Description
Achieve increased productivity over epoxies, silicones and hot melts with easy to use, low cost adhesives. DYMAX UV adhesives cure in seconds. The "on demand" cure feature of these resins means no rework as a result of adhesive migrating onto solder pads or through holes. DYMAX adhesives are ideal for bonding heat sinks and heat sensitive components, wire and component tacking, strain relief of large parts and securing hand inserted components prior to wave soldering.

Unitising, strain relief
Unitising, strain relief
Wire tacking
Wire tacking
Heat dissipation
Heat dissipation
Ruggedising
Ruggedising
Product Selector Guide
Product Applications Features
Electronics adhesives
DYMAX 9-911 Rev A Wire tacking/coil termination On-demand cure for optimal positioning; easily dispensed by hand; exposed areas cure in seconds for immediate strength; shadowed areas may cure with heat over time
DYMAX 9-20558 Bonding Kapton™ polyimide to pcb; strain relief Flexible; moisture barrier for metal, ceramic, epoxy and glass filled plastics
DYMAX 910 Wire and parts tacking; strain relief; unitising Flexible; good adhesion; mechanically removable
DYMAX 912-A Wire tacking Fast curing; withstands wave soldering whilst resisting most solvent and aqueous cleaning processes
DYMAX 914-A Wire tacking on pcb's; for manual and fully automated dispensing systems Good insulation qualities; shock absorbing; deep cure capability; bonds well to porous surfaces; rapid cure speed
Component ruggedising
DYMAX 9422-SC Reinforcing fine pitch or leadless components; underfill replacement; staking; BGA edge bonding; corner bonding Fast, room-temperature cure; adhesion to various PCB substrates; low modulus for reducing stress on board components; highly thixotropic for minimal movement after dispense; See-Cure adhesives appear blue when dispensed and become clear for easy verification of cure
DYMAX 9-20790 Reinforcing fine pitch or leadless components; underfill replacement; staking; BGA edge bonding; corner bonding Fast, room-temperature cure; adhesion to various PCB substrates; low modulus for reducing stress on board components; highly thixotropic for minimal movement after dispense
Potting & sealing
DYMAX 9440 A/B Potting UV silicone; fast tack-free cure; >90 day mix life; low durometer; high depth of cure; ambient temperature cure; low glass transition temperature (Tg); superior performance in thermal excursions; high chemical resistance; solvent free
DYMAX 921 series Potting; ruggedising heavy components Urethane acrylate; light cure in seconds; secondary heat cure; one part, no mixing is required; multiple viscosities; visible light cure for maximum cure depth; adhesion to filled plastics including PBT/Valox®
Thermal management adhesives
DYMAX 9-20801 Adhesive paste Thermally conductive; 1.2 W/mK; UV/Visible light cure for exposed areas in seconds; activator or heat cure shadowed areas; one part; solvent free

Other Information
Download the complete DYMAX Electronics Assembly Adhesives, Coatings & Encapsulants Selector Guide  (466Kb) DYMAX Adhesives for Electronics Selector Guide

DYMAX adhesive used for BGA edge bonding, dispensed by jet
Courtesy www.asymtek.com

Our Technical Bulletins & Articles page has links to:

  • Technical Bulletin: Wire Tacking - The Options
  • Article: Case Histories of Light Curing Adhesives in Electronics Manufacturing
  • Article: Advances in Light Curing Adhesives and Coatings Lead to Process and Quality Benefits in Electronics Manufacturing

See also!
 UV cured masking for electronics
 Silicone thermally conductive compounds
 Light curing conformal coatings
 UV curing lamps & systems

Additional information Additional printed catalogue or brochure available
Obtain more information Obtain more information, samples or literature
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September 2010
Version 3.0

adhere - better bonding from intertronics
17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
Tel: +44 1865 842842   Fax: +44 1865 842172   info@intertronics.co.uk
Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.
© INTERTRONICS 1997, 2010