| Product Selector Guide |
| Product |
Applications |
Features |
| Electronics adhesives |
| DYMAX 9-911 Rev A |
Wire tacking/coil termination |
On-demand cure for optimal positioning; easily dispensed by hand; exposed areas cure in seconds for immediate strength; shadowed areas may cure with heat over time |
| DYMAX 9-20558 |
Bonding Kapton™ polyimide to pcb; strain relief |
Flexible; moisture barrier for metal, ceramic, epoxy and glass filled plastics |
| DYMAX 910 |
Wire and parts tacking; strain relief; unitising |
Flexible; good adhesion; mechanically removable |
| DYMAX 912-A |
Wire tacking |
Fast curing; withstands wave soldering whilst resisting most solvent and aqueous cleaning processes |
| DYMAX 914-A |
Wire tacking on pcb's; for manual and fully automated dispensing systems |
Good insulation qualities; shock absorbing; deep cure capability; bonds well to porous surfaces; rapid cure speed |
| Component ruggedising |
| DYMAX 9422-SC |
Reinforcing fine pitch or leadless components; underfill replacement; staking; BGA edge bonding; corner bonding |
Fast, room-temperature cure; adhesion to various PCB substrates; low modulus
for reducing stress on board components; highly thixotropic for minimal
movement after dispense; See-Cure adhesives
appear blue when dispensed and become clear for easy verification of cure |
| DYMAX 9-20790 |
Reinforcing fine pitch or leadless components; underfill replacement; staking; BGA edge bonding; corner bonding |
Fast, room-temperature cure; adhesion to various PCB substrates; low modulus
for reducing stress on board components; highly thixotropic for
minimal movement after dispense |
| Potting & sealing |
| DYMAX 9440 A/B |
Potting |
UV silicone; fast tack-free cure; >90 day mix life; low durometer; high depth of cure; ambient temperature cure; low glass transition temperature (Tg); superior performance in thermal excursions; high chemical resistance; solvent free |
| DYMAX 921 series |
Potting; ruggedising heavy components |
Urethane acrylate; light cure in seconds; secondary heat cure; one part, no mixing is required; multiple viscosities; visible light cure for maximum cure depth; adhesion to filled plastics including PBT/Valox® |
| Thermal management adhesives |
| DYMAX 9-20801 |
Adhesive paste |
Thermally conductive; 1.2 W/mK; UV/Visible light cure for exposed areas in seconds; activator or heat cure shadowed areas; one part; solvent free |