Dymax 9773 Low Outgassing UV Adhesive for Electronics

About Dymax 9773 Low Outgassing UV Adhesive for Electronics

Dymax 9773 is a UV light-curable low-outgassing adhesive engineered for ruggedising and staking critical electronic components on printed circuit boards (PCBs) in demanding aerospace, satellite, defense and optical environments. It is a single-part adhesive which offers rapid, on-demand curing with UV/Visible light, enabling faster processing and improved throughput.

Dymax 9773 passes the NASA adopted ASTM E595 low-outgassing standard (TML 0.86%, CVCM 0.04 percent) and is NASA MAPTIS-listed (09907), making it suitable for spacecraft, satellites, and sensitive optical/electronic assemblies. It has been shown, under ASTM E595 conditions, to release only very low levels of condensable volatiles, within limits accepted for spacecraft use, and minimises the risk of contamination in vacuum-sensitive optical, thermal, and electronic assemblies.

Dymax 9773 passes MIL-STD-883 Method 5011, demonstrating that it maintains high electrical insulation and stable dielectric behaviour after severe thermal ageing, indicating that ionic content and ionic mobility are sufficiently low for long-life aerospace, space-grade and defence electronics.

The formulation is halogen-free, silicone-free, solvent-free, and fully RoHS and REACH compliant.

This rare combination allows Dymax 9773 to be evaluated for applications in aerospace and defence electronics where contamination control requirements, electrical stability, long-term reliability, and production throughput are actively engineered and audited.

Features & Benefits

• Low ionic content reduces the risk of corrosion or dendritic growth and is compliant with Mil-Std 883 Method 5011
• Low outgassing meets ASTM E595
• On-demand UV/visible cure enables faster throughput and lower process cost
• Immediate handling strength, no ovens, no premixing, no pot life, higher line utilisation
• Mechanically robust, holds components securely, and endures the shock, vibration, and thermal profiles seen in defence and space hardware
• 100% solids, 100% solvent-free, single-part materials
• Non-slumping, stays exactly where you dispense it
• Jetting-compatible for precise application
• Halogen-free, solvent-free, RoHS-compliant – helps you meet strict environmental and regulatory policies without compromising performance
• Silicone-free

Applications

Bonding or structural enhancement of electronics in mission-critical aerospace, defence or optics applications

• Ruggedisation, reinforcement or staking adhesive
• Reinforcement of fine-pitch or leadless components
• Encapsulation
• Shock and vibration absorption
• Underfill

Specifications

All Downloads

Filename	Size	Download
Dymax 9773 Product Data Sheet	1.14MB
Dymax Materials for Aerospace and Defense Systems Selector Guide	6.13MB
Dymax Electronics Assembly Selector Guide	4.27MB
Dymax Ruggedizing Adhesives for Electronic Components	1.14MB

Ordering Information

01865 842842	orders@intertronics.co.uk