electronics

IRS 2125 High Performance Flexible Epoxy Adhesive

IRS 2125 Flexible Epoxy Adhesive is a high performance black resin system. Its combination of flexibility and high adhesive strength lends itself to many high technology bonding, sealing and insulating applications.

IRS 2125 Flexible Epoxy Adhesive is a high performance black resin system. Its combination of flexibility and high adhesive strength lends itself to many high technology bonding, sealing and insulating applications.

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IRS 2012-1 Low Density Light Weight Epoxy Potting Compound

IRS 2012-1 is a very low density, light weight epoxy resin system with excellent physical properties. It is used in systems where weight is critical (e.g. auto sport, motor racing, aerospace).

IRS 2012-1 is a very low density, light weight epoxy resin system with excellent physical properties. It is used in systems where weight is critical (e.g. auto sport, motor racing, aerospace).

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Opti-tec 4200 Optically Clear Polyurethane Encapsulant & Potting Compound

Opti-tec 4200 is a clear, water-white polyurethane resin designed for the potting or encapsulation of electronics, LEDs, electrical products and other items where high transparency and aesthetics are important.

Opti-tec 4200 is a clear, water-white polyurethane resin designed for the potting or encapsulation of electronics, LEDs, electrical products and other items where high transparency and aesthetics are important.

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Dymax LED UV Light Curing Adhesives

Our range of fast and ultra-fast cure Dymax LED UV light curing adhesives are for a variety of medical device, electronics, and many industrial assembly applications. They are specially formulated LED light-curable adhesives for use with LED UV curing lamps. Adhesive bonding for glass, metal, plastics, ceramic, etc.

Our range of fast and ultra-fast cure Dymax LED UV light curing adhesives are for a variety of medical device, electronics, and many industrial assembly applications. They are specially formulated LED light-curable adhesives for use with LED UV curing lamps. Adhesive bonding for glass, metal, plastics, ceramic, etc.

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THINKY SR-500 Solder Paste Mixer & Conditioner

By revolving the container at a high speed and rotating at the same time, the SR-500 Solder Paste Mixer and Conditioner generates powerful acceleration and convection currents, and carries out mixing and degassing simultaneously. Solder powder that settled during storage is uniformly dispersed and returns to a near factory-delivered, high quality state.

By revolving the container at a high speed and rotating at the same time, the SR-500 Solder Paste Mixer and Conditioner generates powerful acceleration and convection currents, and carries out mixing and degassing simultaneously. Solder powder that settled during storage is uniformly dispersed and returns to a near factory-delivered, high quality state.

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Opti-tec 7020 Optically Clear Silicone Potting Compound

Opti-tec 7020 is a two part, clear, non-yellowing liquid silicone elastomer suitable for encapsulation of sensitive electronic or opto-electronic parts.

Opti-tec 7020 is a two part, clear, non-yellowing liquid silicone elastomer suitable for encapsulation of sensitive electronic or opto-electronic parts.

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Electrically Conductive Adhesives from Polytec PT

Polytec PT electrically conductive adhesives are designed for electronic interconnects in a wide range of applications, including hybrid electronic assembly and solder replacement.

Polytec PT electrically conductive adhesives are designed for electronic interconnects in a wide range of applications, including hybrid electronic assembly and solder replacement.

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Dymax UV Light Curing Adhesives for Electronics Assembly

Dymax adhesives are ideal for bonding heat sinks and heat sensitive components, wire and component tacking, strain relief of large parts and securing hand inserted components prior to wave soldering.

Dymax adhesives are ideal for bonding heat sinks and heat sensitive components, wire and component tacking, strain relief of large parts and securing hand inserted components prior to wave soldering.

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