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About WACKER Silicone Encapsulants and Potting Compounds

Silicone encapsulants from WACKER are effective for the potting and encapsulation of electronic control units, sensors, printed circuit boards, semiconductor devices or microchips. Potting or encapsulation provides efficient protection from the environment, assisting in reliable operation over the lifetime of electronic devices.

We offer one and two component WACKER products for potting and encapsulation applications. Silicone gels offer minimal thermal stress on sensitive parts and ensure that the device will work properly even when exposed to extreme temperature fluctuations or strong vibrations. For sensor applications, gels characterised by particularly low volatility and low bleed are becoming increasingly important.

Features & Benefits

  • High thermal shock resistance
  • Low shrinkage
  • Good adhesion including to polymer housings
  • Low outgassing
  • Low uncured-silicone bleed
  • Formulations from Shore 00-55 to A80
  • Transparent versions available

Specifications

Product Characteristics Volume Resistivity (ohm.cm) Dielectric Strengh (KV/mm) Colour Hardness (Shore A) Viscosity (mPas) Temperature Range
Elastosil E10 Flowable sealant with excellent heat stability up to 250ºC, long-term elasticity under thermal stress, and good mechanical properties. Low hardness. Applications include sealing of heating elements. 10^14 21 Transparent 25 8,000 up to 250°C
Elastosil E50N Food compliant, transparent silicone for coating and potting applications including textile coatings. Medium hardness, more rigid than E43N. Transparent 35 50,000 up to 180°C
Elastosil N2034 Flowable, non-corrosive black silicone for technical applications including bonding, sealing, coating, potting and gasketing. Self-levelling with medium hardness when cured, and flame retardant. Black 35 25,000 -50 to 180°C
Elastosil RT 428 Thermally conductive potting compound with excellent heat resistance and high hardness. Recommended for electronics encapsulation. Reddish-brown 65 12,000 200°C
Elastosil RT 601 Highly transparent, low viscosity electronics potting compound for circuit protection. Medium cured hardness. Also useful for optical applications (e.g. solar panels). Food compliant. 10^15 23 Transparent 45 3,500 150°C
Elastosil RT 602 Low viscosity silicone potting compound with rapid heat cure, medium cured hardness and excellent heat stability. Food compliant. 10^15 Light grey 30 3,500 200°C
Elastosil RT 604 Softer than RT 601. Highly transparent, very low viscosity electronics potting compound for circuit protection. Also useful for optical applications (e.g. solar panels). Food compliant. 10^15 23 Transparent 25 800 150°C
Elastosil RT 607 Very hard, flame retardant silicone potting compound with rapid heat cure and excellent heat resistance. Food compliant. 10^15 23 Reddish-brown 55 10,000 210°C
Elastosil RT 745 Tough gel with primerless adhesion and rapid heat cure. Applications include potting and encapsulation of components for measurement and control, sensor technology, and electronics including automotive. 10^16 Translucent-brownish 15 1,000 160°C
Elastosil RT 745 S Softer version of Elastosil RT 745. May be suitable for some automotive applications involving water immersion. 10^15 Translucent-brownish Shore 00 – 37 1,000 160°C
SilGel 612 Crystal clear silicone gel well suited to encapsulation of LEDs, manufacturing of solar panels, and electronics applications. Very low bleed, good adhesion, low stress, flame retardant. Rapid heat cure. 10^15 23 Transparent Very soft gel 1,000 160°C
SilGel 613 Similar to SilGel 612, but is lower viscosity and works with catalysts to speed up curing, including a UV-curing catalyst. Transparent Very soft gel 150 160°C
Silpuran 4200 Medical-grade, biocompatible acetoxy-curing adhesive sealant which meets the requirements of ISO 10993 and USP Class VI. Fast skin time; medium hardness. Translucent 35 300,000
Elastosil RT K Silicone potting compound, condensation curing with Cat T catalyst. Flowable, with good post mix self deaeration. Medium hardness. 10^14 23 Light grey 45 7,000 -50°C to 180°C
Elastosil RT 426 Potting and encapsulation compound for electronics and lighting applications, with excellent heat resistance and high hardness. Reddish-brown 60 15,000 200°C
Semicosil 961 TC Gap filler which cures to a soft, tacky rubber. Highly thermally conductive interface material for electronic heat sink applications. 10^13 8 Yellow 25 130,000 -50° to 180°C

For additional specifications, view our selector guide.

Other Information

See how one customer got results from Wacker SilGel 612 for an LED encapsulation application in this Case Study:

Case Study: LED potting for signage with Wacker SilGel 612 Potting LED strips for outdoor signage made easy with silicone gel

A UK manufacturer of outdoor signage and lighting products was seeking to encapsulate their LED strips to protect them from environmental damage, whilst maintaining a desirable aesthetic in the finished product. Wacker SilGel 612 fit the bill.

All Downloads

Filename Size Download
Case Study: LED potting for signage with Wacker SilGel 612 0.24MB
Wacker Silicone Selector Guide 0.12MB

Ordering Information

Our technical team are on hand to discuss your application requirements. Click here to get in touch.

Find out more information on how to purchase.

  • Last updated: September 2020
  • Version: 2.0

Semicosil®, Elastosil®, and SilGel® are registered trademarks of Wacker Chemie AG. Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.