Adhesive bonding of power modules can often be an alternative to usual joining techniques. Epoxy-based adhesives can generally produce high-strength and stable connections. Whether this also applies to the high requirements in power circuits was the subject of a research project recently performed by the IMTEK Department of Microsystems Engineering and the IESY Institute of Electric Power Systems at the University Freiburg and Magdeburg respectively. Some of the project output has been published in an article in Volume 14, Issue 2, June 2017 edition of Adhesion magazine, authored by our friend Dr. Arno Maurer of Polytec PT.
The conclusion? “Overall, the project shows a significant advance in the development of adhesives for power electronics in comparison to the state of the art a few years ago.”
