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Circuit Frame

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Description
Imagine replacing damaged circuits without the mess of liquid epoxy, with a bond strength equal to the original, on bare or loaded circuit boards -- all in about 30 seconds. Our replacement Circuit Frames with dry-film adhesive backing make this delicate, precise procedure quick and neat. Trim out the circuit you need and bond it to the circuit board surface with a bonding iron or bonding press.

Circuit Frame crccvar0001at

Circuit Frame shown twice actual size

Specifications
Circuit Frame number CRCCVAR001A?
Overall frame size 2.25" x 1.50" (57 x 38 mm)
Pattern size Variety
Base material Rolled annealed copper foil .0014" (.036 mm) thick
Adhesive backing Phenolic butral film adhesive .0018" (.046 mm) thick
Bonding temperature 475ŠF ± 5°F (246°± 14°)
Bonding time 30 seconds
Peel strength Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material
Shelf life 6 months minimum. Each circuit frame is stamped with the expiration date
Plating options
  • Tin/Lead - .0005" (.0127 mm) 60/40 Tin/Lead minimum
  • Bright tin (Lead free) - .0005" Tin (.0127 mm) minimum
  • Nickel/Gold - Gold .000050" (.00127 mm) minimum over Nickel .000100" (.00254 mm) minimum

Ordering information
Part number Description Plating
CRCCVAR0001AT Variety .010" Track (0.254 mm) Tin/Lead
CRCCVAR0001AS Variety, Lead free Bright tin

Additional information Additional printed catalogue or brochure available
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October 2009
Version 2.0

Intertronics Logo

17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
Tel: +44 1865 842842   Fax: +44 1865 842172   info@intertronics.co.uk
Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.
© INTERTRONICS 1997, 2009