This Land Repair kit includes the tools and materials needed to reliably repair or replace damaged lands, surface mount and BGA pads.
The unique Circuit Frames have a dry film adhesive backing. You simply select the appropriate size pad or land, trim it from the Circuit Frame and bond it to the circuit board surface using a bonding iron included in the kit.
This kit is specifically designed to make the repair process as simple and reliable as possible. All the tools and materials are packaged in a rugged ESD safe carrying case.
Features & Benefits
- Includes dry film, epoxy-backed replacement circuits that do not use messy liquid epoxy.
- Includes epoxy for solder mask or base board repair.
- All the tools and materials are neatly arranged in a conductive, ESD safe carrying case.
- Tools and materials conform to IPC guidelines.
- Every item is prime quality, time-tested, to meet high standards.
Directions for Use
How to repair a surface mount pad:
How to repair a land:
A comprehensive instruction manual for all aspects of printed circuit board repair
|CRC201-1402||Land/Pad Repair Kit, 230 VAC|
|CRC115-3102||1||Bonding iron 230 VAC|
|CRC115-2104||1||Bonding tip – tapered|
|CRC115-2204||1||Bonding tip .080″ diameter|
|CRC115-2206||1||Bonding tip .120″ diameter|
|CRC115-2316||1||Bonding tip .080″ x .120″ diameter|
|CRCCFV002AS||1||Circuit frame, variety – bright tin|
|CRCCFV003AS||1||Circuit frame, variety – bright tin|
|CRC235-3025||126||High temp tape discs .25″ diameter|
|CRC235-3050||60||High temp tape discs .50″ diameter|
|CRC115-3115||1||Measuring Microscope Pen|
|CRC335-5185||1||Tweezer, Point Tip|
- Last updated: January 2017
- Version: 3.0
Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.