Circuit Frame

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Description
Imagine replacing damaged circuits without the mess of liquid epoxy, with a bond strength equal to the original, on bare or loaded circuit boards -- all in about 30 seconds. Our replacement circuit frames with dry-film adhesive backing makes this delicate, precise procedure quick and neat. Trim out the circuit you need and bond it to the circuit board surface with a bonding iron or bonding press.

Circuit Frame crccs025035at

Circuit Frame shown twice actual size

Specifications
Circuit Frame number	CRCCS025035A?
Overall frame size	2.25" x 1.50" (57 x 38 mm)
Pattern size	0.025" / 0.035" dia. (0.635mm / 0.889 mm)
Base material	Rolled annealed cooper foil .0014" (.036 mm) thick
Adhesive backing	Phenolic butral film adhesive .0018" (.046 mm) thick
Bonding temperature	475°F ± 25°F (246°C ± 14°C)
Bonding time	30 seconds
Peel strength	Minimum 8lbs / inch (1.43 kg / cm) after cure to FR-4 material
Shelf life	6 months minimum. Each circuit frame is stamped with the expiration date
Plating options	Tin/Lead - .0005" (.0127 mm) 60/40 Tin/Lead minimum Bright tin (Lead free) - .0005" Tin (.00127 mm) minimum Nickel/Gold - Gold .000050" (.00127mm) minimum over Nickel .000100" (.00254 mm) minimum

Ordering information
Part number	Description	Plating
CRCCS025035AT	BGA Pads 0.025" / 0.035" dia. (0.635 mm / 0.889 mm)	Tin/Lead
CRCCS025035AS	BGA Pads 0.025" / 0.035" dia. (0.635 mm / 0.889 mm) Lead free	Bright tin

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October 2009
Version 2.1

17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
Tel: +44 1865 842842 Fax: +44 1865 842172 info@intertronics.co.uk

Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.