Circuit Frame

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Description
Imagine replacing damaged circuits without the mess of liquid epoxy, with a bond strength equal to the original, on bare or loaded circuit boards -- all in about 30 seconds. Our replacement Circuit Frames with dry-film adhesive backing make this delicate, precise procedure quick and neat. Trim out the circuit you need and bond it to the circuit board surface with a bonding iron or bonding press.

Circuit Frame Number: CRC CP090100AT

Circuit Frame shown twice actual size

Specifications
Circuit Frame number	CRCCP090100A?
Overall Frame size	2.25" x 1.50" (57 x 38 mm)
Pattern size	.090"/.100" dia. (2.286 mm/2.540 mm)
Recommended bonding tip	CRC115-2206 .120" dia. (3.048 mm)
Base material	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive backing	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding temperature	475°F ± 25°F (246°C ± 14°C)
Bonding time	30 seconds
Peel strength	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf life	6 months minimum. Each Circuit Frame is stamped with the expiration date
Plating options	Tin/Lead - .0005" (.0127 mm) 60/40 Tin/Lead minimum Bright Tin (Lead Free) - .0005" Tin (.0127 mm) minimum Nickel/Gold - Gold .000050" (.00127 mm) minimum over Nickel .000100" (.00254 mm) minimum

Ordering information
Part number	Description	Plating
CRCCS090100AS	Lands .090" x .100" (2.286 mm x 2.540 mm)	Bright Tin
CRCCS090100AT	Lands .090" x .100" (2.286 mm x 2.540 mm)	Tin/Lead

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October 2009
Version 2.1

17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
Tel: +44 1865 842842 Fax: +44 1865 842172 info@intertronics.co.uk

Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.