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Circuit Frame
Description
Imagine replacing damaged circuits without the mess of liquid epoxy, with a bond strength equal to the original, on bare or loaded circuit boards -- all in about 30 seconds. Our replacement Circuit Frames with dry-film adhesive backing make this delicate, precise procedure quick and neat. Trim out the circuit you need and bond it to the circuit board surface with a bonding iron or bonding press.
Circuit Frame shown twice actual size
| Specifications | |
| Circuit Frame number | CRCCBLANKA? |
| Overall Frame size | 2.25" x 1.50" (57 x 38 mm) |
| Pattern size | Blank |
| Recommended bonding tip | N/A |
| Base material | Rolled annealed copper foil .0014" (.036 mm) thick |
| Adhesive backing | Phenolic Butral film adhesive .0018" (.046 mm) thick |
| Bonding temperature | 475°F ± 25°F (246°C ± 14°C) |
| Bonding time | 30 seconds |
| Peel strength | Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material |
| Shelf life | 6 months minimum. Each Circuit Frame is stamped with the expiration date |
| Plating options |
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| Ordering information | ||
| Part number | Description | Plating |
| CRCBLANKAT | Circuit Frame, Blank 2.25" x 1.50" | Tin/Lead |
| CRCBLANKAS | Circuit Frame, Blank 2.25" x 1.50" (lead free) | Bright Tin |
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May 2012
Version 2.1
17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
t +44 1865 842842 e info@intertronics.co.uk
© INTERTRONICS 1997, 2012