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Circuit Frames
PCB Replacement Tracks and Pads
- Complete in 30 seconds
- Quick and tidy procedure
- Hundreds of shapes available
- Custom made shapes available
Description
Imagine replacing damaged circuits without the mess of liquid epoxy, with a bond strength equal to the original, on bare or loaded circuit boards - all in about 30 seconds. Our replacement Circuit Frames with dry-film adhesive backing make this delicate, precise procedure quick and neat. trim out the circuit you need and bond it to the circuit board surface with a bonding iron or bonding press.
Choose from hundreds of different shapes or let us custom design and fabricate that special shape for you.
| Replacing circuits and pads is done in 4 steps | |
| Step 1 Evaluate the damaged circuits. If the base material is severely damaged it may have to first be repaired using epoxy. See Base Board Repair Kit. Remove the defective pad or conductor and scrape off any soldermask from the connecting circuit. Apply liquid flux to the connecting circuit on the board surface and tin with solder. |
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| Step 2 Select a replacement pad that matches the missing pad. Scrape off the adhesive bonding film from the solder joint area on the back of new pad. Trim out the new pad from the Circuit Frame. Cut from the plated side. |
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| Step 3 Temporarily place the new pad in position using Kapton tape. Then permanently bond the new pad using the Bonding System or Bonding Iron. Bonding time is only 30 seconds. |
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| Step 4 If the new conductor has a connecting circuit, apply liquid flux to the lap solder joint connection area and solder the circuit of the new pad to the circuit on the printed circuit board surface. If desired, apply epoxy to the lap solder joint connection. |
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| Material Specifications | |
| Frame size | 57 x 38 mm |
| Base material | Rolled annealed copper foil 0.036 mm thick |
| Adhesive backing | Phenolic Butral film adhesive 0.046 mm thick |
| Bonding temperature | 246°C ± 14°C |
| Bonding time | 30 seconds |
| Bonding load | See Calibration Settings below |
| Peel strength | Minimum 1.43 kg/cm after cure to FR-4 material |
| Shelf life | 6 months minimum |
| Plating options | |
| Tin/lead | 0.0127 mm 60/40 tin/lead minimum |
| Gold | 0.00127 mm gold over 0.00254 mm nickel minimum |
| Bright tin (lead free) | 0.0127 tin minimum |
| CRC115-2706 Dry Film Adhesive Backing | |
| The dry film adhesive backing is available separately. Each piece is 57 x 38 mm | |
Circuit Frame Table
| Part Number | Surface Mount Pad Frames | Plating options | Bonding Tip | Load |
| CRC CS004085A? | Surface Mount Pads 0.10 mm x 2.20 mm | · Bright tin (lead free) · Tin/lead |
CRC115-2316 | A |
| CRC CS012060A? | Surface Mount Pads 0.30 mm x 1.52 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2302 | A |
| CRC CS012060A? | Surface Mount Pads 0.30 mm x 2.54 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2308 | A |
| CRC CS020028A? | Surface Mount Pads 0.508 mm x 0.711 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2301 | A |
| CRC CS025080B? | Surface Mount Pads 0.63 mm x 2.03 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2304 | B |
| CRC CS028185A? | Surface Mount Pads 0.71 mm x 4.70 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2314 | C |
| CRC CS030055A? | Surface Mount Pads 0.76 mm x 1.40 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2312 | B |
| CRC CS034030A? | Surface Mount Pads 0.86 mm x 0.76 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2310 | A |
| CRC CS038090A? | Surface Mount Pads 0.97 mm x 2.28 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2308 | B |
| CRC CS040070A? | Surface Mount Pads 1.01 mm x 1.77 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2312 | B |
| CRC CS040110A? | Surface Mount Pads 1.01 mm x 2.80 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2308 | B |
| CRC CS045110A? | Surface Mount Pads 1.14 mm x 2.80 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2308 | B |
| CRC CS046106A? | Surface Mount Pads 1.17 mm x 2.70 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2308 | B |
| CRC CS048068A? | Surface Mount Pads 1.22 mm x 1.73 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2312 | B |
| CRC CS050050A? | Surface Mount Pads 1.27 mm x 1.27 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2310 | B |
| CRC CS051087A? | Surface Mount Pads 1.30 mm x 2.21 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2204 | B |
| CRC CS060080A? | Surface Mount Pads 1.52 mm x 2.03 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2312 | B |
| CRC CS065055A? | Surface Mount Pads 1.65 mm x 1.40 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2312 | B |
| CRC CS065095A? | Surface Mount Pads 1.65 mm x 2.41 mm | · Bright tin (lead free) · Tin/lead |
CRC115-2316 | C |
| CRC CS067173A? | Surface Mount Pads 1.70 mm x 4.39 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2318 * | D |
| CRC CS071106A? | Surface Mount Pads 1.80 mm x 2.69 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2316 | C |
| CRC CS090100A? | Surface Mount Pads 2.28 mm x 2.54 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2206 | C |
| CRC CS095095A? | Surface Mount Pads 2.41 mm x 2.41 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2320 | C |
| CRC CS130177A? | Surface Mount Pads 3.30 mm x 4.42 mm | · Bright tin (lead free) · Tin/lead |
Custom | E |
| Part Number | Ball Grid Array Pad Frames | Plating options | Bonding Tip | Load |
| CRC CS015020A? | BGA Pads 0.38 mm x 0.50 mm Diameter | · Bright tin (lead free) · Tin/lead |
CRC 115-2201 | A |
| CRC CS020025A? | BGA Pads 0.38 mm x 0.63 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2312 | A |
| CRC CS025035A? | BGA Pads 0.63 mm/.89 mm Diameter | · Bright tin (lead free) · Tin/lead |
CRC 115-2202 | A |
| CRC CS051063A? | BGA Pads 1.29 mm/1.60 mm Diameter | · Bright tin (lead free) · Tin/lead |
CRC 115-2204 | B |
| Part Number | Conductor Frames | Plating options | Bonding Tip | Load |
| CRC CT006015A? | Conductor Tracks 0.15 mm/0.38 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2314 * | ** |
| CRC CT006025A? | Conductor Tracks 0.15 mm/0.63 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2314 | ** |
| Part Number | Gold Edge Contact Frames | Plating options | Bonding Tip | Load |
| CRC CC035080AG | Gold Edge Contacts 0.89 mm x 2.03 mm | Gold | CRC 115-2312 * | B |
| CRC CC038255AG | Gold Edge Contacts 0.97mm x 6.35 mm | Gold | CRC 115-2314 * | C |
| CRC CC050060AG | Gold Edge Contacts 1.27 mm/1.52 mm | Gold | CRC 115-2314 | F |
| CRC CC050300AG | Gold Edge Contacts 1.27 mm x 7.62 mm | Gold | CRC 115-2314 * | E |
| CRC CC070080AG | Gold Edge Contacts 1.78 mm/2.03 mm | Gold | CRC 115-2318 | F |
| CRC CC070210AG | Gold Edge Contacts 1.78 mm x 5.33 mm | Gold | CRC 115-2318 | F |
| CRC CC076190AG | Gold Edge Contacts 1.93 mm x 4.83 mm | Gold | CRC 115-2318 * | D |
| CRC CC085360AG | Gold Edge Contacts 2.16 mm x 9.14 mm | Gold | CRC 115-2318 | F |
| CRC CC090300AG | Gold Edge Contacts 2.28 mm x 7.62 mm | Gold | CRC 115-2322 | F |
| Part Number | Land Frames | Plating options | Bonding Tip | Load |
| CRC CP050060A? | Lands 1.27 mm/1.52 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2202 | C |
| CRC CP070080A? | Lands 1.78 mm/2.03 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2204 | C |
| CRC CP090100A? | Lands 2.28 mm/2.54 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2206 | D |
| CRC CP090100B? | Lands 2.28 mm x 2.54 mm | · Bright tin (lead free) · Tin/lead |
CRC 115-2206 | C |
| CRC CP140210A? | Lands 3.60 mm ID x 5.33 mm OD | · Bright tin (lead free) · Tin/lead |
Custom | F |
| CRC CP156097A? | Lands 3.96 mm OD x 2.46 mm ID | · Bright tin (lead free) · Tin/lead |
Custom | F |
| CRC CP250125A? | Lands 6.35 mm OD x 3.18 mm ID | · Bright tin (lead free) · Tin/lead |
Custom | F |
| Part Number | Variety Frames | Plating options | Bonding Tip | Load |
| CRC CFV002A? | Variety | · Bright tin (lead free) · Tin/lead |
Variety | ** |
| CRC CVAR0001A? | Variety Track 0.254 mm | · Bright tin (lead free) · Tin/lead |
Variety | ** |
| CRC CBLANKA? | Circuit Frame, Blank | · Bright tin (lead free) · Tin/lead |
Variety | ** |
Bonding Tip
Listing in the above table is the recommended Bonding Tip to use with the particular Circuit Frame.
* Indicates that the closest size Bonding Tip has been listed; a custom size Bonding Tip may be required.
** Indicates that Bonding Loads will vary depending on the particular circuit selected from the Circuit Frame.
| Circuit Surface Area | Load | Setting | Hand Bonding Setting |
| Up to 1.29 mm² | 113 gm | A | A - Very Light Load Approximately equal to the weight of the Bonding Iron. |
| 1.30 mm² to 3.22 mm² | 227 gm | B | B - Light Load Slightly less than twice the weight of the bonding iron. |
| 3.22 mm² to 6.45 mm² | 340 gm | C | C - Light Load Slightly greater than twice the weight of the bonding iron. |
| 6.45 mm² to 9.67 mm² | 680 gm | D | D - Medium Load Approximately half the resting weight of your arm. |
| 9.67 mm² to 16.13 mm² | 907 gm | E | E - Firm Load Slightly less than the resting weight of your arm. |
| 16.13 mm² and greater | 1361 gm | F | F - Firm Load Approximately equal to the resting weight of your arm. |
Bonding Loads
To obtain the maximum bond of the Circuit Frame to the circuit board surface, the proper Bonding Tip temperature, Bonding Tip time, and Bonding Tip load are required. The Bonding Load is based upon the approximate surface area of the replacement circuit. Bonding Irons are included in several repair kits or available separately.
Other Information
Our Technical Resources page has links to:
- Our comprehensive Rework & Repair Guide
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Additional printed catalogue or brochure available |
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Obtain more information, samples or literature |
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Contact details and how to order |
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August 2011
Version 2.2
17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
Tel: +44 1865 842842 Fax: +44 1865 842172 info@intertronics.co.uk
© INTERTRONICS 1997, 2011