Great ideas for the practitioner of high technology, high performance assembly. Looking at: Adhesives for Electronics Assembly Selected for: Leadless Component BGA Reinforcement Adhesives How do you secure components so that they are resistant to shock, vibration and rough handling? Various technologies are available for ensuring critical components on printed circuit boards remain in place and with electrical integrity throughout manufacturing, assembly qualification and service environment for the duration of product lifecycle. Should one BGA or PoP interconnect fail, a whole device will be compromised. DYMAX has developed the next generation family of adhesives engineered specifically for bonding high value pcb components so that the assembly is rugged. DYMAX light curing adhesives dispense and cure in seconds to provide the optimal balance of production efficiency and technical performance. The use of BGA edge bonding adhesives or underfills can eliminate leadless component interconnect cracking due to CTE mismatches. Typical applications include mobile phones, PDAs, laptop computers, gaming consoles, GPS computers and digital music players. Unlike underfills or heat curing epoxies, Light Curing Adhesives offer: · Fast dispense & cure · Reduce stress on interconnects during push, pull, shock, drop and vibration · Enhance assembly life span · Post reflow, room temperature application · Easy rework · Simple visual inspection Some specific benefits of DYMAX technology for component reinforcement include: · Cure in seconds · Engineered bead shape for wetting both board surface and component edge without seeping into shadowed areas · Highly thixotropic for zero movement prior to cure · Low modulus for minimal stress in component interfaces · Available with See Cure Technology · Exhibit improved bond strength for die and pry testing · Halogen free · Silicone free · RoHS compliant DYMAX 9-20790 and DYMAX 9422-SC have high viscosity and high thixotropy for zero flow after dispensing and prior to cure. They are ideal for reinforcement of electronic components on pcb's, and BGA edge bonding. Please see Light Curing Adhesives for Electronics Assembly for a video demonstrating the jet dispensing of BGA edge bonding adhesive. You can also download a copy of the DYMAX Electronic Materials Assembly Selector Guide. Unit 17 Station Field Industrial Estate, Banbury Road, Kidlington, Oxfordshire, OX5 1JD, ENGLAND Tel: +44 (0)1865 842842     Fax: +44 (0)1865 842172 e-mail: info@intertronics.co.uk    www.intertronics.co.uk Read our latest news Please don't send any more of these great ideas, thanks!