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About Polytec PT Thermally Conductive Adhesives in Cartridges

Polytec PT Thermally Conductive Adhesives are packed in 50ml side-by-side cartridges for convenient manual processing. Polytec TC 406, Polytec TC 411 and Polytec TC 422 are two-component epoxies that cure at room temperature and are used for thermal management in electronics assembly, hybrid circuits, sensor manufacture and power engineering.

  • Polytec TC 406 offers some of highest thermal conductivity available in cartridge-packaged epoxies (2.2 W/mK)
  • Polytec TC 411 has very good thermal conductivity (1.4 W/mK) alongside a Shore D 38 hardness for extra flexibility and resilience
  • Polytec TC 422 offers an easy-to-process 50,000 cP viscosity for good flow characteristics

We also offer several other thermally conductive adhesives from Polytec, supplied in bulk containers, twin-packs, or premixed and frozen syringes.

 Polytec TC 406Polytec TC 411Polytec TC 422
Mechanical propertiesrigidflexiblerigid
Thermal conductivity2.2 W/mK1.4 W/mK0.8 W/mK
Temperature stabilitygoodgoodgood
Adhesion to Alvery goodvery goodvery good
Adhesion to cataphoretic paintvery goodvery goodvery good
Adhesion to PAvery good


Features & Benefits

  • Cartridge packaging allows for simple processing
  • Application direct from the cartridge with a static mixing nozzle, using a dispensing gun
  • Adhesives are supplied in the correct mixing ratio
  • High thermal conductivity, particularly with Polytec TC 406
  • Electrically insulating
  • Flexible version available (Polytec TC 411)
  • Cures at room temperature; curing can be accelerated with heat
  • Room temperature storage


Dispensing Polytec TC422 with DTD50

These cartridge-packaged adhesives can be easily dispensed with a simple dispensing gun or with a Fisnar DTD50 50ml cartridge dispenser


Polytec PT thermally conductive adhesives are designed for thermal management in:

  • electronics
  • lighting
  • hybrid technology
  • sensor technology
  • power engineering
  • other high-performance technology applications



Specification Method Polytec TC 406 Polytec TC 411 Polytec TC 422
Colour when mixed TM 101 white white blue
Mix ratio by volume 2:1 2:1 2:1
Pot life at 23°C (h) TM 702 0.5 2 1
Shelf life at 23°C (months) TM 701 12 12 12
Consistency TM 101 pasty pasty pasty
Specific gravity when mixed (g/cm³) TM 201.2 1.9 1.5 1.9
Viscosity when mixed at 23°C (cP) TM 202.1 180,000 140,000 50,000
Hardness (Shore D) DIN EN ISO 868 85 38 85
Max. service temperature (continuous) (°C) TM 302 -55 / +150 -55 / +150 -55 / +160
Max. service temperature (short-term) (°C) TM 302 240 220 260
Degradation temperature (°C) TM 302 300 280 310
Glass transition temperature (Tg) (°C) TM 501 65 <20 65
Thermal conductivity (W/mK) TM 502 2.2 1.4 0.8
Young’s Modulus (N/mm2) TM 605 5000 n.d. 7500
Tensile strength (N/mm2) TM 605 27 3 44
Lap sheer strength (AI/AI) (N/mm2) TM 604 14 7 19
Elongation at break (%) TM 605 3.5 11 1.2
Min. curing temperature (°C) 15 15 15
Curing time at 23°C (h) 24 48 24
Curing time at 80°C (min) 60 90 60

All Downloads

Filename Size Download
Polytec PT Thermally Conductive Adhesives in Side-by-Side Cartridges 0.26MB
Polytec TC 406 Data Sheet 0.23MB
Polytec TC 411 Data Sheet 0.23MB
Polytec TC 422 Data Sheet 0.23MB

Ordering Information

Part number Description
POLTC406-50ML Polytec PT TC 406 epoxy adhesive, 50 ml cartridge
POLTC411-50ML Polytec PT TC 411 epoxy adhesive, 50 ml cartridge
POLTC422-50ML Polytec PT TC 422 epoxy adhesive, 50 ml cartridge
IDM2N24 Static mixing nozzle
IDM805001 Manual dispensing gun 50ml 1:1/2:1 ratios


Next Steps

Find out more information on how to purchase.

Our technical team are on hand to discuss your application requirements, click here to get in touch.

  • Last updated: May 2020
  • Version: 1.6

Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.