Hot Air Levelling
Masking Tape
- Good conformance
- No baking required
- No residue
- No tearing
Description
INT 760 Hot Air Levelling Masking Tape is based on a paper/polyester film, coated with a heat resistant polysiloxane adhesive. INT 760 resists temperatures up to 300°C short term and can be removed from the substrate without leaving any adhesive residue. The polyester reinforcement prevents tape tearing during removal.
Applications
Masking tape for hot air solder levelling (HASL or HAL) of printed circuit boards. Suitable for masking gold fingers. INT 760 Hot Air Levelling Tape conforms to pcb contours and irregularities, and gives a well defined masking line.
Use Data
Once applied to the area of the pcb to be masked, it is recommended that a pressure roller be applied to the tape to ensure fine edge protection. Use of heated rollers or baking of the tape is not required. INT 760 can be stripped from the printed circuit board after soldering without leaving any adhesive residue or without tearing.
| Specifications | |
| Supporting base | Paper/polyester film |
| Total thickness | 0.25mm |
| Adhesive | Polysiloxane |
| Adhesive strength | 5.0 N/cm |
| Tensile strength | 75 N/cm |
| Elongation | 6% |
| Temperature resistance | Up to 300°C short term |
| Colour | Grey |
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See also! Kapton masking tape High temperature masking tape
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November 2004
Version 2.0
17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
Tel: +44 1865 842842 Fax: +44 1865 842172 info@intertronics.co.uk