IRS 2040-1 Epoxy Potting Compound, Flame Retardant Encapsulating Compound
About IRS 2040-1 Epoxy Potting Compound
IRS 2040-1 Epoxy Potting Compound is a non-toxic general purpose flame retardant encapsulating compound. It has a long pot life and can be cured at ambient temperatures or accelerated with heat. When cured, IRS 2040-1 exhibits good surface finish, high electrical strength, good thermal conductivity, low exotherm and low cure shrinkage. It is compatible with most PCB components and materials over a wide range of temperatures. In addition to this it has excellent adhesion to most plastic and metal substrates. IRS 2040-1 is suitable for a wide variety of applications due to its combination of properties and ease of use. It does not contain halogens or heavy metals and comes in a standard colour of black.
Features & Benefits
- High electrical insulating characteristics
- Good thermal conductivity
- Low shrinkage
- High adhesion
- Flame retardant to UL94 V-0 @ 3mm
- Good chemical and water resistance
- Meets the requirements of WEEE and RoHS
- Long pot life
- Cured at room temperature or with heat
Part number change: As of Version 3.0, May 2020, the part number of this product changed from IRS2040 to IRS2040-1. This is due to an unavoidable change in a formulation component. The new formulation has some different properties, and we recommend that you re-evaluate this product if you were using an earlier version.
|Specific gravity (g/ml)||1.70||1.87||1.05|
|Viscosity m.Pa.s @ 25°C||6,500||70,000||400|
|Mix ratio||8.5:1 resin to hardener (weight)
4.8:1 resin to hardener (volume)
|Pot life||40-80 minutes (150g @ 25°C)|
|Gel time||180 minutes (150g @ 25°C)|
|Cure schedule||Minimum cure:
24 hrs @ 20°C
2 hrs @ 60°C
1 hr @ 80°C
|Operating temperature range||-55 to + 130°C|
|Flammability||UL94 V-0 @ 3mm|
|Tensile strength||14 mPa|
|Compressive strength||60 mPa|
|Thermal conductivity||0.85 W/mK|
|Elongation at break||0.7%|
|Loss tangent||0.060 @50Hz|
|Coefficient of thermal expansion||35-55 ppm/°C|
|Impact strength||310 KJ/m^2|
|Electric strength||18 kV/mm|
|Relative permittivity||4.8 @50Hz|
|Flexural strength||31.3 MPa|
|Flexural modulus||2.08 GPa|
|Water absorption||0.3% (30 days @ 20°C)|
|Safety Data Sheets|
|For the latest SDS for this product, please e-mail [email protected]|
See how these customers got results from IRS 2040-1 for electronics potting applications in these Case Studies:
|Application Insight – Electronics Assembly Potting
Potting electronic modules for vehicles using IRS 2040-1.
|Application Insight – Industrial Switch Potting
Potting of mass-produced switches regularly used in the oil and gas industries, manufacturing, mining, marine and many other extreme environments using IRS 2040-1.
|Application Insight – LED Power Supply Potting
Potting of electronic components and power supplyof specialist LED displays using IRS 2040-1.
IRS 2040-1 is available in twinpacks or in bulk.
The twinpack sachet is a clear film sachet, with the resin and hardener separated by a removable clip and rail divider. Click here for twinpack mixing instructions.
In kit form, resin and hardener are provided in separate containers to the correct ratio. In most cases pour the hardener into the larger resin container and use it as a mixing vessel. Stir well using appropriate mixer until homogeneous.
|IRS2040-1-1000G||Epoxy potting compound, flame retardant, black – 1kg twinpack|
|IRS2040-1-5KG||Epoxy potting compound, flame retardant, black – 5kg kit|
For best results, store away from strong oxidising agents, strong acids and strong bases. Store in a cool, well-ventilated area. Keep container tightly closed. Keep in original packaging.
Let’s start by talking about your application
|01865 842842||[email protected]|
- Last updated: September 2023
- Version: 3.6
Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.