No-Clean Wick
Desoldering Braid

Description
Techspray's No-Clean Wick has changed the perception of desoldering braids. It removes up to four times more solder than conventional wick, and extracts solder much faster than wicks based on Type R fluxes. Our flux has an improved wicking action. The residue left behind is halide free and non-conductive so it does not have to be cleaned in most circumstances. Techspray No-Clean Wick is designed to improve reworking efficiency in both conventional and no-clean operations.

Techspray No-Clean Wick is rosin free, colophony free, and does not give off a rosin fume.

New and improved Techspray No-Clean Wick avoids common problems in lead-free processes - lead-free soldering requires higher temperatures, which can cause charring, over-activation of the flux and poor solder removal. It also tends to bake on any flux residues. The new flux formulation is more tolerant to the higher temperatures and greater thermal shocking. Lead-free solders often have a higher surface tension, so require a high quality wick in order to function quickly and efficiently. Please evaluate in your lead-free process.

Ultra-clean!
Independent cleanliness testing (to ISO 9455-17 standard by the National Physics Laboratory) showed excellent stable, repeatable and high SIR measurements. Techspray No-Clean Wick leaves little, if any, residues affecting SIR levels. Microscopic examination of the pcb's showed no dendrites. Our desoldering braid is the cleanest! It will give the most reliable desoldering results.

Features & Benefits
Techspray's No-Clean Wick outperforms competition in laboratory testing. Solder Absorption and Solder Travel are the two characteristics of desoldering braids affecting wicking efficiency.

• Solder Absorption indicates the amount of solder the braid can absorb in a fixed time frame. The more solder that can be absorbed, the smaller the wick size that can be used. This allows for more efficient heating and protects the components from excessive heat.
• Solder Travel is an indication of the distance which the solder travels up the wick in a given time frame. The further solder can travel along the braid, the more solder that can be absorbed and the faster the solder is removed.

Directions
Be sure the solder iron is at adequate temperature. Different size braids may need an adjustment in temperature. For solder removal, place proper size braid in equal size diameter of soldering tip onto solder joint. Apply firm pressure down with a slight rotation of the wrist to ensure that all of the solder is removed. Remember that fast wicking is very important to ensure that the pcb will not be damaged due to extensive heat. Do not apply any lateral pressure to the circuit board, which may cause damage to pads.

Availability

No-Clean Wick Anti-Static Bobbin
Size/ Colour	SMT #0 Grey	#1 White	#2 Yellow	#3 Green	#4 Blue	#5 Brown	#6 Red
Product	TEC1827	TEC1820	TEC1821	TEC1822	TEC1823	TEC1824	TEC1825
Width	.025" (0.63 mm)	.035" (0.9 mm)	.055" (1.4 mm)	.075" (1.9 mm)	.098" (2.5 mm)	.130" (3.3 mm)	.193" (4.9 mm)
Availability	TEC1827-5F TEC1827-10F	TEC1820-5F TEC1820-10F TEC1820-25F TEC1820-50F	TEC1821-5F TEC1821-10F TEC1821-25F TEC1821-50F	TEC1822-5F TEC1822-10F TEC1822-50F TEC1822-100F	TEC1823-5F TEC1823-10F TEC1823-25F TEC1823-100F	TEC1824-5F TEC1824-25F	TEC1825-5F
-5F is a five foot spool, -10F is a 10 foot spool, etc

Our Techspray Wick Performance Challenge!
We will prove that we have the best quality product on the market. Request your free evaluation sample today!

Other Information
Our Technical Resources page has links to:

• Our comprehensive Rework & Repair Guide

See also!  Techspray Pro Wick  Techspray Unfluxed Wick

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January 2008
Version 4.0