SolderQuick
BGA Reballing Preforms

SolderQuick BGA Reballing Preforms
Originally developed by Raychem Corporation in 1994, the SolderQuik^® Solder Preform is the low-volume ball attach solution. It is an easy, fast, and low-cost technique for BGA reballing in volumes ranging from a few to several thousand. The wide variety of available patterns makes the SolderQuik BGA Preform an attractive and flexible solution for BGA reballing requirements.  Typical applications include prototyping, small volume runs, quality to reliablity testing, and reballing of BGA components.

SolderQuikBGA Preform consists of an array of solder spheres embedded in a water soluble carrier. The preforms can be made in almost any possible array pattern, including various pitches and ball diameters.

SolderQuik BGA Preforms will accurately place a new array of solder spheres relying on simple physical properties rather than operator skill. Winslow places the solder spheres within a 0.0004" tolerance in the carrier material. The preform process relies on edge registration with the package to align the array on the package, and the self-centering characteristics of eutectic solder perfectly centers the solder balls to the pads during reflow.

Features & Benefits

• Easy - Learning to use the preform takes less than 10 minutes.  Simply flux, apply, and reflow!
• Flexibility - Small volume ball attach methods using stencils generally require you to have a different stencil for all of your different array patterns, which gets very expensive.
  Winslow Automation currently has a growing database of "standard" array patterns, with new ones being added all the time. We use very flexible tooling to make our preforms. Even if we don't currently have the pattern you need, for a small programming charge we can make nearly any pattern from your drawing.
• Adaptability - The SolderQuik BGA Reballing Preforms are designed to work well with the equipment and tools you already have. You can use them with almost any reflow system (convection oven or reflow oven), and they work well alongside most rework stations used for component removal and preparation.
• Better throughput means lower labour costs - Using stencil methods with either loose solder spheres or solder paste, you can typically process only one component at a time.
  Using SolderQuik® BGA Reballing Preforms, you can process many parts at the same time with only a few minutes of extra labor. Using preforms, those parts could all just as easily have different pitches, array patterns, and ball diameters.
• Proven technology - Originally developed by Raychem Corporation in 1994, the Solderquik Preform received the SMT Product of the Year Award in 1998.  Since then, its low cost, quick turn, east of use & reliability are unmatched.
  

Instructions
Ensure all parts are cleaned and baked (for moisture removal) before reflow
1) Insert Preform		Watch our video to see how easy the process is.
2) Check Alignment
3) Apply Past Flux
4) Insert BGA
5) Reflow
6) Moisten & Remove Paper

BGA Reball Starter Kit Contents
The SolderQuick BGA Reball kit is housed in a black plastic carrying case includes:

• 25 identical SolderQuick BGA Preforms of your choice
• BGA Preform Fixture to match your chosen preform
• Quick reference process guide
• Comprehensive instruction manual detailing everything from deballing to reballing including bake and dry packaging and profiling your reflow equipment.
• Flux syringe
• 2 x 250ml bottles with flip top lids for easy dispensing of IPA and de-ionized water
• Cleaning tray
• Other small tools and supplies needed in the process including tweezers, ESD cleaning brush, acid brush, scissors, desoldering braid, conductive mat, IPA wipes, and assorted finger cots
• MSDS sheets

SolderQuik BGA Reballing Preform Technical Specifications
Ball Diameter		Acceptable Pitch					Min Offset	Solder Alloy		Body Size Range
mm	in	1.27mm	1.00mm	0.80mm	0.65mm	0.50mm	mm	Pb Free	Pb	mm
0.762	0.030						0.90	Sn96.5- Ag3- Cu0.5*	Sn63- Pb37	3.5 by 3.5 to 85 by 85
0.635	0.025						0.90
0.610	0.024						0.80
0.559	0.022						0.80
0.508	0.020						0.75
0.457	0.018						0.75
0.381	0.015						0.65
0.330	0.013						0.65
* Our lead free alloy is SAC305

Other Information

•  SolderQuick BGA - Reballing Quick Guide
•  SolderQuick BGA - Reballing Instruction Manual

See also!  Flextac BGA Rework Stencils  INTERTRONICS ITS800 Soldering Aid  Base Board Repair Kit  Professional PCB Repair Kit

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July 2011
Version 2.0