Flexible
• No stencils or special tooling required. Pick from our existing list of preforms or send us your requirements
• Use any reflow heating system


Easy
• No more fumbling around with loose balls or hassling with washing flux from stencils


Clean
• Avoid sticky stencils


Reliable
• Eliminates ball migration and contamination

SolderQuik BGA
Winslow Automation's SolderQuik Ball Grid Array Preform provides the most cost effective solution for reattaching solder spheres to Ball Grid Array (BGA) components. Whether prototyping, testing, or reworking, one can now easily ball or reball BGA components using SolderQuik BGA Preforms.

Variety of Sizes
Under exclusive license from Raychem Corporation, Winslow Automation uses patented SolderQuik technology to provide a solder delivery device for BGA components. SolderQuik BGA consists of individual solder ball preforms held in a grid array by a water soluble paper/polymer holder. SolderQuik BGA Preforms are available in any standard or custom patterns, and solder ball diameters.

Testing
Packages can be reballed using the SolderQuik BGA device for failure analysis.

Rework
The SolderQuik BGA Preform is an easy economical choice for rework, and gets components back into production fast.

Prototyping
The SolderQuik BGA Preform is available in most standard JEDEC array patterns or configurations and if we do not have the one you want, we can easily do custom array patterns. This unique product allows for easy and inexpensive testing of new BGA package designs.

Typical application steps:

SolderQuik BGA Preforms are available in a multitude of solder alloys, patterns, and solder ball diameters. Application of this device uses inexpensive reflow equipment available to most customers as part of their standard surface mount operation:

SolderQuik BGA Reballing Starter Kit

SolderQuik Technology
Originally developed by Raychem Corporation as a method for attaching solder columns to leadless chip carriers, SolderQuik technology has been chosen as the ultimate solution for reballing ball grid array (BGA) packages. Since its introduction, this patented technology, in the form of SolderQuik BGA Preforms, has become the undisputed choice among leading semiconductor and board assembly manufacturers.

BGA Reball Starter Kit Contents
The SolderQuik BGA Reball Kit is housed in a black plastic carrying case and includes:

• 25 identical SolderQuik BGA Preforms of your choice
• BGA Preform Fixture to match the chosen preform
• Quick Reference Process Guide
• Comprehensive instruction manual detailing everything from deballing to reballing including bake and dry packaging and profiling your reflow equipment.
• Flux syringe
• 2 x 250ml bottles with flip top lids for easy dispensing of IPA and de-ionized water
• Cleaning tray
• Other small tools and supplies needed in the process including tweezers, ESD cleaning brush, acid brush, scissors, desoldering braid, conductive mat, IPA wipes, and assorted finger cots
• MSDS sheets

Available BGA Fixtures

Fixture part no.	Package size
WAI-43-001	21 x 21 mm
WAI-43-002	23 x 23 mm
WAI-43-003	27 x 27 mm
WAI-43-004	31 x 31 mm
WAI-43-005	35 x 35 mm
WAI-43-006	40 x 40 mm
WAI-43-007	42.6 x 42.6 mm
WAI-43-008	15 x 15 mm
WAI-43-009	25 x 25 mm
WAI-43-010	29 x 29 mm
WAI-43-011	45 x 45 mm
WAI-43-012	19.5 x 19.5 mm
WAI-43-013	32.5 x 32.5 mm
WAI-43-014	37.5 x 37.5 mm
WAI-43-015	42.5 x 42.5 mm
WAI-43-016	26.9 x 26.9 mm
WAI-43-017	42.8 x 42.8 mm
WAI-43-018	33 x 33 mm
WAI-43-019	13 x 13 mm
WAI-43-020	20 x 20 mm
WAI-43-021	11 x 11 mm
WAI-43-022	10 x 10 mm
WAI-43-023	12 x 12 mm
WAI-43-024	16 x 16 mm
WAI-43-025	17 x 17 mm
WAI-43-100	* flexible fixture

If specific dimensions of the package being reballed are not listed above, please contact us for the latest availability.

* The flexible fixture is adjustable from 5mm to 57mm square (or rectangular). In general, fixed size fixtures are easier to use.

Internet Preform Search
If you are connected to the Internet, then you can use the SolderQuik on-line database to search for the BGA preform you need. There are now over 1000 preforms available.

• A SolderQuik BGA Preform Database (for most up to date list, please use the Internet Preform Search above)
• The instruction manual for SolderQuik BGA Starter Kit
• Demonstration movies

• Technical Bulletin TB2002-06 - Preform Method Simplifies Small Volume BGA Ball Attach/Reattach