Circuit Bonding Evaluation Kit
- Economical - lets you evaluate IPC recommended repair processes
- Complete instructions included
Description
The tools and materials in this kit let you evaluate the IPC recommended process for replacing damaged surface mount and BGA pads, lands, and edge contacts. It’s the ideal, low-cost way to “test drive” and evaluate this money saving repair process.
Before & After
Includes materials to evaluate surface mount pad
repair using replacement dry film adhesive backed pads
repair using replacement dry film adhesive backed pads
Applications
This kit provides materials to evaluate the following:
- Replacing damaged surface mount pads
- Replacing damaged BGA pads
- Replacing damaged lands
- Replacing damaged edge contacts
| Part No | Description |
| CRC 201-1132 | Circuit Bonding Evaluation Kit, 230 VAC |
Circuit Bonding Evaluation Kit includes:
| Part No | Qty | Description |
| CRC 115-3103 | 1 | Bonding Iron, 230 VAC |
| CRC 115-2104 | 1 | Bonding Tip, Tapered |
| CRC 115-2306 | 1 | Bonding Tip, .040" x .060" |
| CRC 115-2318 | 1 | Bonding Tip, .080" x .500" |
| CRC CFV003T | 1 | Circuit Frame, Variety |
| CRC 115-3302 | 1 | Epoxy |
| CRC 235-2102 | 1 | Foam Swab |
| CRC 355-2102 | 1 | Knife |
| CRC 115-3314 | 1 | Mixing Stick |
| CRC 115-3312 | 1 | Plastic Cup |
| CRC 115-3360 | 1 | Plastic Probe |
| CRC 950-4508 | 1 | Tape, Kapton |
| CRC 335-5183 | 1 | Tweezer |
Other Information
Our Technical Resources page has links to:
- Our comprehensive Rework & Repair Guide
Additional printed catalogue or brochure available
Obtain more information, samples or literature
Contact details and how to order
Rework & Repair
Main Index
Search
Home
September 2002
Version 1.0
