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| CRC 201-1102 |
Micro Pad Repair Kit |
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Description A multifunctional epoxy is included for over coating the lap solder joint formed between the replacement pad and connecting circuitry. Step-by-step instructions for replacing surface mount and BGA pads are outlined in the manual included with each kit. This manual is an excellent tool for repair technicians and covers techniques that can be used in a variety of repair applications. Note: For small (under .040” wide) surface mounts and BGA pads the Circuit Bonding System is recommended to more precisely control the bonding force. ![]() Applications
Features and Benefits
![]() Kit Includes:
Other Information Our Technical Resources page has links to:
Additional printed catalogue or brochure available
Obtain more information, samples or literature
Contact details and how to order
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Category: Rework & Repair Main Index Search Home December 2002 |
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| Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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