CRC115-3219
- Precision design - permits bonding of minute patterns
- Heavy duty construction - ensures platform stability
- Built-in calibration slide maintains regulated bonding force
- Temperature controller maintains uniform bonding temperature for better results
Description
Repair technicians appreciate the accuracy of this calibrated Bonding Press, especially when repairing surface mount and BGA pads. The press not only gives the operator better control over the bonding process, but also ensures optimal adhesion and repeatability. The rework stand has a built-in calibration slide to maintain a regulated bonding force depending upon the circuit pattern size and shape. A digital temperature controller maintains a uniform temperature throughout the 30-second bonding cycle.
Applications
- Replacing damaged surface mount pads
- Replacing damaged BGA pads
- Replacing damaged lands
- Replacing damaged gold contacts
| Specifications | |
| Frame construction | 11 gauge steel |
| Throat depth | 30 cm |
| Throat height | 17 cm |
| Vertical travel | 17 cm |
| Weight | 4.5 kg |
| Temperature Controller | |
| - Range | Ambient to 871°C |
| - Resolution | 1°C |
| Cycle Time | 2 to 80 sec |
| Power Consumption | 5 VA max |
| Heat Output | 20 Watts |
| Heat Up Time | 10 minutes |
| Part Number | Description |
| CRC 115-3218 | Circuit Bonding System w/Temperature Controller, 230 VAC |
| CRC 115-3219 | Circuit Bonding System w/Fixed Temperature, 230 VAC |
Additional printed catalogue or brochure available
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Contact details and how to order
Rework & Repair
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September 2002
Version 1.0
