Masking Tape
- Wave solder masking
- Hot air levelling
- Powder coating
Description
INT 755 is based on crepe paper, coated with a silicone adhesive. Applications involve any high temperature masking, include wave soldering, hot air levelling (HAL), powder coating etc.
INT 755 is especially suitable for wave solder masking on printed circuit boards, even gold contacts. It can be removed after soldering without leaving adhesive residue.
INT 755 is particularly useful where static charges generated by film-based tapes are considered a problem, as the paper base of INT 755 generates much less static on application and removal.
INT 755 is also recommended for masking printed circuit boards during hot air levelling (HAL). Best performance is achieved when the tape is applied and pressed down with rollers, preferably heated up to 100°C.
| Specifications | |
| Base material | Impregnated crepe paper |
| Base thickness | 0.120mm |
| Total thickness | 0.140mm |
| Adhesive | Polysiloxane |
| Colour | Buff |
| Temperature resistance | Maximum 260°C for 20 seconds |
| Adhesive strength | 2.0 N/cm |
| Tensile strength | 35 N/cm |
| Ultimate elongation | 12% |
| Standard roll length | 55m |
| Standard roll widths | from 6mm up |
| Die cut discs | Standard diameters (mm) 4, 6, 8, 9, 10, 12, 16 |
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See also! INT 701 Kapton Polyimide Masking Tape & Dots INT 610 Masking Tape for Powder Coating, Plasma Spray
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PCB Assembly, Soldering & Surface Mount
Adhesive Tapes
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October 2003
Version 2.0
17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
Tel: +44 1865 842842 Fax: +44 1865 842172 info@intertronics.co.uk