1 6

About Flextac BGA Rework Stencils

These flexible solder paste BGA rework stencils are laser cut from high quality, anti-static polymer film with a residue-free adhesive backing. Because they are self-sticking, no tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when the paste is applied. Easy to use and leave no residue on the board surface.

Typical BGA rework stencils are made from metal and require fixturing or taping to position them and hold them in place. Metal stencils warp easily, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat metal stencils contaminating the circuit board surface. Metal stencils require tedious stencil cleaning. To use metal stencils effectively, a high level of operator skill is required.

Features & Benefits

  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable – eliminates tedious stencil cleaning
  • Flexible – conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case

Applications

  • Applying solder paste for BGA rework

Directions for Use

How Flextac BGA Rework Stencils Work

CRC201-3120 BGA rework stencil step 1
1) Select the proper size and fold up the side tabs
CRC201-3120 BGA rework stencil step 2
2) Peel off the cover film exposing the adhesive backing
CRC201-3120 BGA rework stencil step 3
3) Place in position using the handy side tabs
CRC201-3120 BGA rework stencil step 4
4) Apply paste using a standard metal squeegee
CRC201-3120 BGA rework stencil step 5
5) Remove the stencil and save for another reuse or dispose

Ordering Information

Individual Stencils

Supplied in packages of 10

Part number Thickness Aperture Ball count Ball pattern Pitch Component body
CRCB4-064-1013-100 .004″
(0.102 mm)
.020″
(0.508 mm)
64 8 x 8
Full Array
.039″
(1.00 mm)
10 mm x 13 mm
CRCB4-078-0911-080 .004″
(0.102 mm)
.017″
(0.432 mm)
78 9 x 13
Array
.0315″
(0.80 mm)
9 mm x 11.5 mm
CRCB4-084-0814-080 .004″
(0.102 mm)
.017″
(0.432 mm)
84 9 x 15
Array
.0315″
(0.80 mm)
11 mm x 13 mm
CRCB6-256-1717-100 .006″
(0.152 mm)
.021″
(0.533 mm)
256 16 x 16
Array
.039″
(1.00 mm)
17 mm x 17 mm
CRCB4-256-1717-100 .004″
(0.102 mm)
.020″
(0.508 mm)
256 16 x 16
Full Array
.039″
(1.00 mm)
17 mm x 17 mm
CRCB6-272-2727-127 .006″
(0.152 mm)
.025″
(0.635 mm)
272 20 x 20
P4-Row
+4 x 4 Center
.050″
(1.27 mm)
27 mm x 27 mm
CRCB6-360-2525-127 .006″
(0.152 mm)
.025″
(0.635 mm)
360 19 x 19
Array
.050″
(1.27 mm)
25 mm x 25 mm
CRCB4-484-2323-100 .004″
(0.102 mm)
.020″
(0.508 mm)
484 22 x 22
Full Array
.039″
(1.00 mm)
23 mm x 23 mm
CRCB4-672-2727-100 .004″
(0.102 mm)
.020″
(0.508 mm)
672 26 x 26
Full Array
.039″
(1.00 mm)
27 mm x 27 mm

 


Next Steps

Our technical sales team are on hand to discuss your application requirements. Click here to get in touch.

Find out more information on how to purchase.

  • Last updated: August 2021
  • Version: 5.1

Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.