Dymax 2000-MW Series UV Adhesives for Wearable Medical Devices

About Dymax 2000-MW Series UV Adhesives for Wearable Medical Devices

The Dymax 2000-MW series of wearable device adhesives cure on exposure to UV and/or visible light in seconds, enabling faster processes, greater output and lower processing costs. All adhesives in the range are compliant with ISO 10993-5 for cytotoxicity, with some grades available that also meet ISO10993-10 for sensitisation and irritation.

The Dymax 2000-MW series is the first dedicated, light curable adhesive product line specifically formulated without materials of concern and common skin irritants to address medical wearables applications. These first-in-class biocompatible adhesives were developed to address changing customer requirements and rapidly evolving trends in the wearable device market. Developed without isobornyl acrylate (IBOA), a common skin irritant.

The series of adhesives produce strong bonds and dependable performance against moisture and thermal shock. Made of 100% solids ensures no solvents are released during application and curing, eliminating the need for solvent handling, while enhancing worker safety and minimising environmental impact.

In-line inspection is made possible with Ultra-Red® fluorescing formulations for an easy, clear process validation. Materials are designed for applications including structural bonding, encapsulating or coating medical wearable electronic components.

Features & Benefits

  • Medical Device Adhesive Oxygen SensorFormulated without IBOA
  • Compliant to ISO 10993-5 for cytotoxicity
  • ISO 10993-10 grades are available for sensitization and irritation
  • Cures on demand, in seconds, with UV and/or visible light
  • 100% solids, 100% solvent-free, single-part materials
  • Ultra-Red® fluorescing formulations for easy, clear process validation

Applications

  • Medical Device SensorElectronics encapsulation
  • Needle-to-hub bonding
  • Edgebonding
  • Battery reinforcement
  • Wire and flex tacking
  • Assembly bonding

Selector Guide

Adhesive Typical application Substrates
Dymax 2101-MW-UR
DYM2101-MW-UR
Dymax 2101-MW-UR is a medium viscosity light cure adhesive that bonds using LED or broad spectrum UV light. The material uses Ultra-Red® fluorescing for simple in-line inspection of UV curing materials. The medical adhesive forms a highly reliable bond to many plastics such as ABS, PC, PCTG, PETG, PVC, and TPU. This makes it an ideal substance to test for the assembly of medical smart devices, patient monitoring devices, large volume injectors or diabetes care devices. ABS, PC, PCTG, PETG, PVC, TPU
Dymax 2022-MW
DYM2022-MW
Dymax 2022-MW is a versatile general bonding adhesive, coating, and encapsulant with low water absorption and minimized water ingression. It offers extremely low water absorption of 0.5% making it ideal for the assembly or encapsulation of electronic wearable medical device components. Dymax 2022-MW is recommended for use as a coating or encapsulant on RFID chips or sensors housing assemblies, and single- or multi-use medical devices where moisture ingression is a concern. It bonds well to stainless steel, aluminum, glass, and printed circuit boards. ABS, PC, PETG, AI, SS, Al, Glass, FR-4

 

Safety Data Sheets
For the latest SDS for this product, please e-mail msds@intertronics.co.uk

All Downloads

Filename Size Download
Light-curable materials for wearable medical device assembly 1.03MB
Adhesives for Medical Wearable Device Assembly 3.40MB
INTERTRONICS Medical Device Assembly Brochure 3.66MB
Instant On-line QC with New Fluoroescing UV or Visible Light Curing Adhesives 0.12MB

Ordering Information

orange_phone01865 842842 orange_email  orders@intertronics.co.uk


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  • Last updated: November 2022
  • Version: 1.2

Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.