ACC EGel 3003 is a transluscent, soft, adherent, silicone elastomeric gel designed for the encapsulation and protection of electronic components. It features chemical adhesion. All silicone gels have mechanical adhesion (tack) but do not automatically form a chemical bond with the substrate. This new heat cured gel forms a stong chemical bond which will prevent moisture ingress. Electronic potting applications and general encapsulation applications which are subject to harsh environmental condition will benefit from this additional adhesion.
Low viscosity makes mixing easy and cure is complete after 30 minutes @ 120°C. Contact us for details.