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| OPT 6055 OPT 6065 OPT 6085 |
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Description Our unique Opti-tec 6000 series temporary adhesives are virtually insoluble in cold or cool water, thus providing a strong bond in the presence of aqueous cutting lubricants and coolants. However, when submerged in heated water, they will completely dissolve. The use of Opti-tec OPT 1009 Cleaner and ultrasonic or air agitation greatly speeds debonding and aids in producing very clean finished parts. Opti-tec 6000 series temporary adhesives offer environmental and health & safety benefits. They are biodegradable. They replace the use of hazardous solvents, and eliminate wax clean-up and residues. Normally, used cleaning/removal water can be put down the drain.
Applications
Opti-tec OPT 6055 has the lowest melting and bonding temperature and is generally used for lapping, backgrinding, wafer bonding and wafer thinning. It puddles quickly and can spread as thin as 0.004 mm. It is our most popular material. Slightly resilient. Opti-tec OPT 6085 has the highest melting and bonding temperature and is used as a backfill for bonding parts that are not flat. It is also used for grooving, cutting, slicing and dicing hard, single crystal materials. This product has higher tensile strength than other thermoplastics, and is the hardest material without being brittle. Opti-tec OPT 6065 is a formulation with the properties of both OPT 6055 and OPT 6085. It is an excellent all purpose product for either lapping and grinding or slicing and dicing. Hard.
Instructions for use
Packaging
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April 2006 |
![]() 17 Station Field Industrial Estate, Banbury Road KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND Tel: +44 1865 842842 Fax: +44 1865 842172 info@intertronics.co.uk |
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| Statements, technical information and recommendations
contained herein are based on tests we believe to be reliable but
they are not to be construed in any manner as warrantees expressed
or implied. The user shall determine the suitability of the product
for his intended use and the user assumes all risk and liability
whatsoever in connection therewith.
© INTERTRONICS 1997, 2006 |
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