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INT TA106

High Temperature
Silicone Transfer Adhesive

Preliminary information

Description
INT TA106 High Temperature Silicone Transfer Adhesive is used for permanent bonding and fixing applications in demanding conditions. It is useful for special bonding, laminating and mounting applications which require high temperature resistance. This silicone adhesive also exhibits excellent bonding to silicone-based substrates. INT TA106 also forms high strength bonds to plastic, glass, ceramic and metal surfaces. It has good solvent resistance.

INT TA106 is supplied on two release liners. The first liner protecting the adhesive is a silicone paper and the second liner, onto which the adhesive is coated, is based on polyester film.

Applications
Laminating for high temperature applications. Temporary or permanent attachment of materials or components during high temperature processing.

Directions
Surfaces to bonded should be clean and dry and free from grease, oils, dust or moisture. Remove paper interliner. Apply adhesive to substrate, using even pressure. Allow to dwell for approx. 5 minutes. Remove polyester interliner and apply second substrate.

Specifications
Adhesive Polysiloxane
Adhesive thickness 0.050mm
Colour Colourless
Adhesive strength 3.5 N/cm
Temperature resistance Long term: -40°C to +180°C
Short term: up to 300°C
Interliners Inner: release coated silicone paper
Outer: release coated 0.050mm polyester film

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Adhesives, Coatings & Sealants
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May 2005
Version 0.9

adhere from intertronics
17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
Tel: +44 1865 842842   Fax: +44 1865 842172   info@intertronics.co.uk
Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.
© INTERTRONICS 1997, 2005