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Circuit Frame
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Circuit Frame Number: CRC CP070080AT


Circuit Frame shown twice actual size.

Specifications

Overall Frame Size: 2.25" x 1.50" (57 x 38 mm)
Pattern Size: .070"/080" dia. (1.778 mm x 2.023 mm)
Recommended Bonding Tip: No. 115-2204 0.080" dia. (2.032 mm)
Base Material: Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing: Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature: 475°F ± 25°F (246°C ± 14°C)
Bonding Time: 30 seconds
Peel Strength: Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life: 6 months minimum. Each Circuit Frame is stamped with the expiration date.
Standard Plating: .001" (.0254 mm) 60/40 tin/lead minimum.
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November 2002
Version 1.0
Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.