
| INT 871 | Gold Finger Testing Tape |

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For BS9000 ManufacturersINT 871 Gold Finger Testing Tape has been specifically designed for the testing of the adhesion of gold plating to base metal, as per the test described in BS9760: 1977, 1.2.5.4 Adhesion of Plating, the object of which is to assess the adhesion of plating to its base metal. The adhesion of plating to the base metal shall be measured on specimens similar to the patterns for edge-contact testing shown in the sectional specifications. For production testing the adhesion of plating shall be measured on the edge contacts or any specified conductors with a minimum area of 100mm² contained on the production board. Alternatively the test can be made on a suitable specimen contained in the board cut-off. The tape to be used for the test should be a non-transferable type with an adhesion value greater than 7.2 N per 25 mm width. The plated area must be thoroughly cleaned with a suitable organic solvent. The tape shall be applied to the plated area under test using the fixed-weight roller method as described in appendix F of BS3924:1965 care being taken to exclude all air bubbles. INT 871 will leave no residue. The plating and tape are inspected visually for flaking or blistering of the plating. Also useful for IPC test methods - from IPC-TM-650 Test Methods Manual
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Specifications
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Category: PCB Fabrication Inspection Adhesive Tapes Main Index |
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August 1997
Version 1.0

| Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warranties expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith. |
