Encapsulants
for Microelectronic Assembly
- Fast cures - clear resins cure in 5 to 15 seconds
- Encapsulants for rigid or flexible circuits
- Cure on demand - only upon exposure to light
- Complete wicking in seconds at room temperature
- Precise flow control and easy dispensing
- One part - no freezing or thawing necessary
- Room temperature storage - unlimited pot life
- Low cost, compact curing systems
- Low stress
- Free of particulate fillers
- Resistance to humidity and thermal shock
- High ionic purity
- Both optically clear and black grades available
Description
Tough, flexible UV light curing encapsulants cure in seconds and cut costs and processing times associated with microelectronic assembly. DYMAX 9000 Series encapsulating materials have high ionic purity, excellent adhesion, and resistance to humidity and thermal shock to effectively protect components. These encapsulants contain no sharp, abrasive mineral or glass fillers to abrade fine wires, and their combination of low Tgand low modulus means low stress. Ultraviolet light curing resins are ideal for glob top and chip on board (COB) applications and are especially suited for encapsulating IC’s on flex circuits. Clear and black grades are available along with a wide range of viscosities, from thin wicking to non-flowing gel.
 Glob tops |
 Viscosities for dam and fill |
 Encapsulants for flex circuits |
 Encapsulating LEDs |
| Product Selector Guide | ||
|---|---|---|
| Product | Applications | Features |
| DYM 9001-E-v3.0 | Thin coating, wicking and underfill | Low viscosity; can be cured in shadow areas at 120°C |
| DYM 9001-E-v3.1 | Glob top | Medium viscosity; can be cured in shadow areas at 120°C |
| DYM 9001-E-v3.5 | Precision application to specific electronic assembly areas | High viscosity; can be cured in shadow areas at 120°C |
| DYM 9001-E-v3.7 | Precision application to specific electronic assembly areas | Highest viscosity; can be cured in shadow areas at 120°C |
| DYM 9008 | Encapsulating on flex/polyimide | High adhesion to polyimide to –40°C; flexible |
| DYM 9-20558 | Strain relief or chip encapsulation | Flexible; moisture barrier for metal, ceramic, epoxy and glass filled plastics |
Other Information
Download the DYMAX Microelectronics Encapsulants Selector Guide  (408Kb) |
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See also! LED doming & coating resins Silicone encapsulants Light curing conformal coatings UV curing lamps & systems
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April 2005
Version 2.0
17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
Tel: +44 1865 842842 Fax: +44 1865 842172 info@intertronics.co.uk