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Great ideas for the practitioner of high technology, high performance assembly.
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News From the Leader in Dummy Components, Test PCBs and Kits
Stacked Packages Take Off!
PoP stacks, Package on Package or Package Stackable Very-Thin Fine-Pitch BGAs (PSvfBGA), are a vertical alignment of very thin BGA packages. Two BGAs, one on top of the other! They are specifically designed to integrate logic and memory components in separate packages using a standardised architecture.
Since its introduction at the end of 2004, Amkor's award winning package stackable very thin fine pitch BGA (PSvfBGA), (the bottom, high density package that enables PoP stacks), has been one of the fastest growing new products in Amkor's history. The semiconductor industry shipped approximately 67 million PoP packages in 2006 and the estimates are that the market for PoP packages doubled in 2007. The next few years promise to provide many new challenges and applications for PoP, as handheld multimedia applications continue to demand higher processing power and memory storage capacities. Amkor is committed to maintain strong development and production capabilities to ensure they are meeting next generation PoP requirements.
Through our sales partners Practical Components, we can supply test vehicles (dummy components), which are available in both 12 and 14 mm body sizes. I/O count for the 12mm is 128 (top) and 305 bottom. 14mm I/O count is 152 (top) and 353 (bottom). PoP (PSvfBGA) packages are available in SAC405, 305, 105 and SAC125Ni formulations.
This PoP 14mm Test Board and Kit is designed as a test vehicle for the Amkor (PSvfBGA) 14x14 353 PoP package. PoP packages from Amkor focus on high density logic devices.
PoP packages are designed for products such as cell phones, digital cameras and other mobile applications benefiting from the combination of stacked packages and small footprint technology. This test board enables the end user to test their process applications on the top and bottom PoP components. With daisy-chain patterns in both packages and the PCB200 Board, customers are able to check for continuity to guarantee the integrity of their process.
- Board size is 132 x 77mm, 8 layers, .039" thick, no microvias
- Board material is IS-410 High Temp. 180Tg
- Standard board finish is OSP Entek CU-106A-HT
- 15 daisy-chain pad placements for 14x14 353 PSvfBGA component
- Immersion Silver board finish is available upon special request. MOQ may apply.
- Gerber and X,Y Theta data included at no charge
More interest in this technology? Attend the SMART Group seminar day on May 1st. More information can be found here.
Practical Catalogue for Dummy Components and Test Boards & Kits Now Available
Dummy SMT components are available in all popular IC fine pitch packages (test die) including Lead-Free Rohs/WEEE compliant formulations. Package on Package (PoP), BGA, TSSOP, QFP, TSOP, CSP, Flip Chip, LQFP, Melf, QFP, PBGA, SSOP, Surface Mount Resistors, (SMR), Capacitors, Surface Mount Capacitors, (SMC) and most components are available with daisy chain. Practical is also a leader in solder training kits and PCB training and test boards partnering with companies like Cookson, AIM, Tessera, Indium and Amkor.
The catalogue can be downloaded from our website, or you can request a FREE printed copy.
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Unit 17 Station Field Industrial Estate, Banbury Road, Kidlington, Oxfordshire, OX5 1JD, ENGLAND
Tel: +44 (0)1865 842842 Fax: +44 (0)1865 842172
e-mail: info@intertronics.co.uk
www.intertronics.co.uk
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