Clear, fast plastic bonder... including acrylic!

Araldite 2028 adhesive is a fast setting, transparent, two-part polyurethane adhesive. What makes this adhesive different is that it is both transparent and UV stable, as well as flexible and fast curing.

Araldite 2028 bonds wide varieties of plastics including polymethyl methacrylate (PMMA) and polycarbonate (PC). Tailor made for seismic cables and cable assemblies, as well as general industrial applications.

Araldite 2028 will find many applications in bonding acrylic sheets and parts; it is clear and quick to cure, so our customers making point-of-sale (POS) displays and signs/signage will find it invaluable.

PC016 Soldering Kit conforms to J-STD-001D specifications

The Practical Components PC016 Mixed Technology Kit is an effective and economical way to train and evaluate students and employees. This kit contains a variety of standard surface mount and through-hole components with tracks to simulate real world situations. Each kit comes individually boxed with all components bagged and labeled for easy identification. It conforms to the IPC J-STD-001D standard for soldering, world-recognised as the sole industry-consensus standard covering soldering materials and processes.

Both tin-lead and lead-free kits are available. The PCB016 board is 3" x 4", .062" thick. IS-410 board material. HASL and immersion silver finish is available.

Video - mixing and degassing LED phosphors

We just added a video to our page about the THINKY Mixing and Vacuum Degassing Machines. It demonstrates the successful mixing and dispersion of LED phosphors into a silicone resin with absolutely no air bubbles.

Get tough - making electronics rugged

We are getting tough with electronic components that need to be made more rugged – to be more resistant to shock, vibration and rough handling. This “toughening-up” process involves edge bonding or underfill of components with the recently introduced DYMAX 9422-SC or DYMAX 9-20790 room temperature, fast, light cure adhesives.

In particular the DYMAX 9422-SC is a component reinforcement and staking material engineered to hold critical components, such as Ball Grid Arrays (BGA) and Video Graphic Arrays (VGA), for secondary processes or for long-term reliability. These light-curable adhesives dispense and cure in seconds to provide the optimal balance of production efficiency and technical performance. This will be of interest to anyone confronted with the need to ensure that critical components on printed circuit boards remain in place and with electrical integrity throughout the manufacturing, assembly qualification and service environment for the duration of a product lifecycle. Light curing adhesives dispense and cure in seconds to provide the optimal balance of production efficiency and technical performance with bead shape designed to wet both the board surface and the component edge without seeping into shadowed areas. This material is highly thixotropic for zero movement prior to cure - 9422-SC is halogen and silicone free and RoHS compliant.

The use of BGA edge bonding adhesives or underfills can eliminate leadless component interconnect cracking due to CTE mismatches. Typical applications include mobile phones, PDAs, laptop computers, gaming consoles, GPS computers and digital music players.

DYMAX 9422-SC features See-Cure technology (going from blue when uncured to colourless when cured) and features fast dispense and cure, easy re-work, simple visual inspection and covering in seconds with improved bond strength for die and pry testing.