Solder paste sticking? Award winning solution!

We are delighted to announce that our sales partners Transition Automation have received a notice that the company's new Self-Cleaning Squeegee system was selected to be showcased at this year's IPC Innovative Product Showcase at the Apex trade show.

A panel of leading industry specialists chose 10 products out of 556 entrants.

Both Lead-Free and traditional solder paste printing processes exhibit a high degree of solder paste sticking. This sticking produces undesirable affects, such as paste bleeding defects, premature contamination of the stencil surface, and requirement for more cleaning interruption. Process cycle time is affected negatively as the paste requires time to drop off the squeegee after each print stroke.

The new invention named Permalex Paste Manager achieves lower overall sticking compared to normal dual squeegees, and the system reduces the migration of solder paste within the print area.

Let us know if you want more information. In the meantime, congratulations to Mark and his team!