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INDEX adhere - better bonding from intertronics

Potting Compounds
& Encapsulants
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 Description
Our range of potting compounds and encapsulants include epoxy, polyurethane and silicone chemistries, to provide for every application. Features include low density, lightweight, flame retardant, flexible, optical transmission - a high performance selection for your high performance applications.

Potting compounds

Product Index
Potting compound IRS 3071
Polyurethane potting compound
Flame retardant encapsulating compound
  • Semi-rigid
  • Black
  • Flame retardant
  • High thermal conductivity
  • Room temperature cure
Potting compound twinpack IRS 2040
Flame retardant epoxy potting compound
  • High electrical insulating characteristics
  • Non-toxic
  • Good thermal conductivity
  • Low shrinkage
  • High adhesion
  • Flame retardant to UL94-V0 @ 3mm
  • Good chemical and water resistance
Potting compound IRS 2012
Light weight, low density epoxy potting compound
  • Low density & light weight
  • Black potting & encapsulation system
  • RF transparent
  • Excellent mechanical & electrical properties
  • Low cure shrinkage
Potting compound twinpack IRS 2013
Flexible, low stress epoxy potting compound
  • Low stress
  • Black potting & encapsulation system
  • Bonds to flexible substrates
  • Excellent electrical properties
  • Low viscosity, unfilled system
optic-tec logo Opti-tec 5020
Optically clear epoxy potting compound
  • Clear
  • Low viscosity
  • Low stress
  • Room or low temperature cure
Clear potting for electronics Opti-tec 7020
Optically clear silicone rubber encapsulant
  • Optically clear
  • Compliant
  • Room or low temperature cure
  • Non-yellowing
  • Low shrinkage
opt4200 image Opti-tec 4200
Optically clear polyurethane potting compound
  • Non-yellowing
  • Excellent long term UV stability
  • Scratch and mark resistant
  • Very low viscosity
  • Ideal for LED encapsulation
Potting Silicone encapsulants & potting compounds
  • Wide range of mix ratios, hardness & viscosity
  • Optically clear grades
  • Silicone gels
  • Thermally conductive grades
  • Suitable for both thin and deep section cure

April 2012
Version 1.5

 adhere - better bonding from intertronics
INTERTRONICS
17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
t +44 1865 842842  e info@intertronics.co.uk
Statements, technical information and recommendations contained herein are based on tests we believe to be reliable but they are not to be construed in any manner as warrantees expressed or implied. The user shall determine the suitability of the product for his intended use and the user assumes all risk and liability whatsoever in connection therewith.
© INTERTRONICS 1997, 2012