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Encapsulants
for Microelectronic Assembly
- Fast cures - clear resins cure in 5 to 15 seconds
- Encapsulants for rigid or flexible circuits
- Cure on demand - only upon exposure to light
- Complete wicking in seconds at room temperature
- Precise flow control and easy dispensing
- One part - no freezing or thawing necessary
- Room temperature storage - unlimited pot life
- Low cost, compact curing systems
- Low stress
- Free of particulate fillers
- Resistance to humidity and thermal stock
- High ionic purity
- Both optically clear and black grades available
Description
Tough, flexible UV curing encapsulants cure in seconds and cut costs and processing times associated with microelectronic assembly. DYMAX 9000
Series encapsulating materials have high ionic purity, excellent adhesion and resistance to humidity and thermal stock to effectively protect
components. These encapsulants contain no sharp, abrasive mineral or glass fillers to abrade fine wires, and their combination of low Tg and
low modulus means low stress. Ultraviolet light curing resins are ideal for glob top and chip on board (COB) applications and are especially suited for
encapsulating IC´s on flex circuits. Clear and black grades are available along with a wide range of viscosities, from thin wicking to non-flowing
gel.
 Glob tops |
 Viscosities for dam and fill |
 Encapsulants for flex circuits |
 Encapsulating LEDs |
| Product Selector Guide | ||
| Product | Applications | Features |
| DYMAX 9001-E-v3.0 | Thin coating, wicking and underfill | Low viscosity; can be cured in shadow areas at 120°C |
| DYMAX 9001-E-v3.1 | Glob top | Medium viscosity; can be cured in shadow areas at 120°C |
| DYMAX 9001-E-v3.5 | Precision application to specific electronic assembly areas | High viscosity; can be cured in shadow areas at 120°C |
| DYMAX 9001-E-v3.7 | Precision application to specific electronic assembly areas | Highest viscosity; can be cured in shadow areas at 120°C |
| DYMAX 9008 | Encapsulating on flex/polyimide | High adhesion to polymide to - 40°C; flexible |
| DYMAX 9-20558 | Strain relief or chip encapsulation | Flexible; moisture barrier for metal, ceramic, epoxy and glass filled plastics |
Other Information
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Download the complete DYMAX Electronics Assembly Adhesives, Coatings & Encapsulants Selector Guide |
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See also! LED doming & coating resins Silicone encapsulants Light curing conformal coatings UV curing lamps & systems DYMAX Complete Range Adhesives and Curing Equipment |
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May 2012
Version 2.2
17 Station Field Industrial Estate, Banbury Road
KIDLINGTON, Oxfordshire, OX5 1JD, ENGLAND
t +44 1865 842842 e info@intertronics.co.uk